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https://www.riss.kr/link?id=O38082766
2001년
eng
학술저널
PAN PACIFIC MICROELECTRONICS CONFERENCE
495-504 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
Annual Pan Pacific microelectronics symposium
6th
Kauai, HI
2001; Feb
0
상세조회0
다운로드
Plating Chemical Evaluations and Reliability of Lead-Free Leadframe Packages
A Shear Strength Study of Lead-Free Solder Spheres for BGA Applications on Different Pad Finishes
CSP Board Level Reliability Testing of Pb-Free Sn-Ag-X (X=Cu,IN) and Polymer-Core Solder Ball
Effects of No-Lead PCB Finishes on Disk Drive Assembly Process