Bonding Characteristics of Solder and Sinter Joints on Active-Metal-Brazing Substrates with Nano Sputtered Ag-Cu-Ti Brazing Filler Metal

다국어 초록 (Multilingual Abstract)

In this study, to improve the bonding interfacial characteristics of active metal brazing (AMB) substrates, a Ag-Cu-Ti brazing filler metal (BFM) layer was formed on aluminum nitride (AlN) and silicon nitride (Si3N4) ceramics by nano sputtering. The AMB substrates were manufactured by brazing bonding. The measured peel strengths of the bonding interfaces of the AlN and Si3N4 ceramics were 2.35 kgf/mm and 4.26 kgf/mm, respectively.
Fracture surface analysis revealed AlN crack initiation at the ceramic/BFM interface, which progressed into the ceramic interior. Silicon carbide (SiC) devices for a power module were bonded on the AMB substrates by Sn-3.0Ag-0.5Cu soldering and Ag sintering bonding. To compare the deterioration characteristics of the joint interfaces, a thermal shock test was conducted. Microstructural analysis after the thermal shock test showed that no defects occurred at the Si3N4/BFM interface, whereas delamination occurred at the AlN/BFM interface. Summarizing, in this study, the characteristics of AMB interfaces coated with a Ag-Cu-Ti BFM using the sputtering process were identified and the suitability of a SiC-based power module package was confirmed.