반도체 성형용 Epoxy 수지계에서의 polysiloxane 의 분산특성에 관한 연구 I : Epoxy 변성 Polysiloxane

다국어 초록 (Multilingual Abstract)

The dynamic mechanical thermal properties and dispersion properties of epoxy molding compound(EMC) according to the change of epoxy modified polysiloxane modifier grade and mixing temperature have been investigated using Dynamic Mechanical Thermal Analyser(DMTA) and several kinds of microscopes. The compatibilities between epoxy modified polysiloxane and epoxy resin system increase with mixing temperature and lower viscosity of modifier. The modulus of epoxy resin system decreases with the smaller domain size of modifier and the increase of compatibility between modifier and epoxy resin system, however, the modifier with the very low viscosity shows the good compatibilities, but should not represent lower modulus.