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An Overview of Current Issues and Future Trends in CMP Consumables
Philipossian, A.; Moinpour, M. VLSI Multilevel Interconnection Conference 1996 p.13-20
An Improved Polish Pad Conditioner for CMP
Morgan, C.; Manfredi, P.; Chamberlin, T.; Walton, E. VLSI Multilevel Interconnection Conference 1996 p.21-24
Polishing Properties of Tungsten Slurries - A Comparison of Available Products
Zaleski, M.; Ward, S. VLSI Multilevel Interconnection Conference 1996 p.25-31
Pad Degradation and Conditioning Studies for CMP of Interlayer Dielectric Films
Achuthan, K.; Babu, S. V.; Campbell, D. R.; Curry, J. VLSI Multilevel Interconnection Conference 1996 p.32-39
Improving CMP Performance Using Grooved Polishing Pads
Weling, M.; Drill, C.; Parmantie, W.; Fawley, G. VLSI Multilevel Interconnection Conference 1996 p.40-46
Polishing Performance of the Rodel EX2000 Pad
Pangrie, S. K.; Salugsugan, I.; Dangca, A.; Segovia, M. VLSI Multilevel Interconnection Conference 1996 p.47-56
Characterization of Pad Conditioning Profiles in Oxide Chemical-Mechanical Polishing
Freeman, P. W.; Markert, L. VLSI Multilevel Interconnection Conference 1996 p.57-60
Application of Laser Scanning Confocal Microscopy to Surface Topography Measurement of CMP Pads
Stein, D. J.; Cecchi, J. L.; Hetherington, D. L.; Kaufman, F. B. VLSI Multilevel Interconnection Conference 1996 p.61-64
Homma, Y.; Furusawa, T.; Kusukawa, K.; Nagasawa, M. VLSI Multilevel Interconnection Conference 1996 p.67-73
Characterizing Variations in ILD CMP Planarization Rates Using Atomic Force Microscopy
Hetherington, D. L.; Farino, A. J.; Strausser, Y. E. VLSI Multilevel Interconnection Conference 1996 p.74-81