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    Cr-Mo강의 비연삭에너지 특성 = Analysis of Specific grinding characteristics

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    https://www.riss.kr/link?id=T12172110

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    다국어 초록 (Multilingual Abstract) kakao i 다국어 번역

    In this study, series of grinding tests have been carried out on Cr-Mo steel workpieces. The workpieces were prepared for different hardness levels through different heat treating processes. In grinding tests, WA and CBN wheels of different grain size were used with varying conditions of cutting depth and workpieces velocity. Experimental results show that the specific grinding energy decreases as the maximum undeformed chip thickness increases regardless of hardness of workpieces and type of wheel used.
    Less specific energy is consumed in the case of smaller abrasive grain size of same kind and with workpieces of intermediate hardness. The energy efficiency of CBN wheel is less than that of WA wheel.
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    In this study, series of grinding tests have been carried out on Cr-Mo steel workpieces. The workpieces were prepared for different hardness levels through different heat treating processes. In grinding tests, WA and CBN wheels of different grain size...

    In this study, series of grinding tests have been carried out on Cr-Mo steel workpieces. The workpieces were prepared for different hardness levels through different heat treating processes. In grinding tests, WA and CBN wheels of different grain size were used with varying conditions of cutting depth and workpieces velocity. Experimental results show that the specific grinding energy decreases as the maximum undeformed chip thickness increases regardless of hardness of workpieces and type of wheel used.
    Less specific energy is consumed in the case of smaller abrasive grain size of same kind and with workpieces of intermediate hardness. The energy efficiency of CBN wheel is less than that of WA wheel.

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    목차 (Table of Contents)

    • 1. 서론 1
    • 2. 기초이론 2
    • 2.1 평균입자 연삭모델 2
    • 2.2 최대미변형칩 두께 (hmax) 3
    • 2.3 비연삭에너지 () 8
    • 1. 서론 1
    • 2. 기초이론 2
    • 2.1 평균입자 연삭모델 2
    • 2.2 최대미변형칩 두께 (hmax) 3
    • 2.3 비연삭에너지 () 8
    • 3. 연삭실험 9
    • 3.1 연삭력 측정 9
    • 3.2 실험 조건 및 사용 숫돌 10
    • 4. 실험결과 및 고찰 12
    • 4.1 비연삭에너지 12
    • 5. 결론 23
    • 참고문헌 24
    • 영문초록 25
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