1 주진원, "무아래 간섭계를 이용한 WB-PBGA 패키지의 온도변화 및 굽힘하중에 대한 거동해석" 대한기계학회 26 (26): 11-1308, 2002
2 Darveaux, R., "Thermal and Power Cycle Limit of Plastic Ball Grid Array (PBGA) Assemblies" 315-326, 1995
3 Pang, J. H. L., "Thermal Cycling Analysis of Flip-Chip Solder Joint Reliability" 24 (24): 705-712, 2001
4 Chen, S. C., "The Numerical Analysis of Strain Behavior at the Solder Joint and Interface in a Flip Chip Package" 171 : 125-131, 2006
5 Darveaux, R., "Solder joint fatigue life model" 213-218, 1997
6 Han, B., "Recent Advancements of Moire and Microscopic Moiré Interferometry for Thermal Deformation Analysis of Microelectronics Devices" 38 (38): 278-288, 1998
7 Skipor, A. F., "On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder" 118 : 1-11, 1996
8 Cho, S.-M., "Observing Real-Time Thermal Deformations in Electronic Packaging" 26 (26): 25-29, 2002
9 Jung, W., "Nonlinear Analysis of Full-matrix and Permeter Plastic Ball Grid Array Solder Joint" 1-19, 1996
10 Lee, T., "Finite Element Analysis for Solder Ball Failures in Chip Scale Packages" 38 (38): 1941-1947, 1998
1 주진원, "무아래 간섭계를 이용한 WB-PBGA 패키지의 온도변화 및 굽힘하중에 대한 거동해석" 대한기계학회 26 (26): 11-1308, 2002
2 Darveaux, R., "Thermal and Power Cycle Limit of Plastic Ball Grid Array (PBGA) Assemblies" 315-326, 1995
3 Pang, J. H. L., "Thermal Cycling Analysis of Flip-Chip Solder Joint Reliability" 24 (24): 705-712, 2001
4 Chen, S. C., "The Numerical Analysis of Strain Behavior at the Solder Joint and Interface in a Flip Chip Package" 171 : 125-131, 2006
5 Darveaux, R., "Solder joint fatigue life model" 213-218, 1997
6 Han, B., "Recent Advancements of Moire and Microscopic Moiré Interferometry for Thermal Deformation Analysis of Microelectronics Devices" 38 (38): 278-288, 1998
7 Skipor, A. F., "On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder" 118 : 1-11, 1996
8 Cho, S.-M., "Observing Real-Time Thermal Deformations in Electronic Packaging" 26 (26): 25-29, 2002
9 Jung, W., "Nonlinear Analysis of Full-matrix and Permeter Plastic Ball Grid Array Solder Joint" 1-19, 1996
10 Lee, T., "Finite Element Analysis for Solder Ball Failures in Chip Scale Packages" 38 (38): 1941-1947, 1998
11 Ye, H., "Failure Modes and FEM Analysis of Power Electronic Packaging" 38 (38): 601-612, 2002
12 Joo, J., "Evaluation of thermal Deformation Model for BGA Packages Using Moiré Interferometry" 14 (14): 230-239, 2004
13 Anand, L., "Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures" 104 : 12-17, 1982
14 Joo, J. W., "Characterization of Flexural and Thermo mechanical Behavior of Plastic Ball Grid Package Assembly Using Moiré Interferometry" 45 (45): 637-646, 2005
15 Pang, J. H., "CBGA Solder Joint Reliability Evaluation Based on Elastic Plastic Creep Analysis" 122 (122): 255-261, 2000
16 Wang, G. Z., "Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys" 123 (123): 247-253, 2001