This study reports the grinding characteristics of silicon carbide (SiC) using diamond grinding wheel. Grinding experiments were performed at various grinding conditions including grinding directions(up grinding, down grinding), table speeds and depth...
This study reports the grinding characteristics of silicon carbide (SiC) using diamond grinding wheel. Grinding experiments were performed at various grinding conditions including grinding directions(up grinding, down grinding), table speeds and depth of cuts. The grinding forces at various table speed and depth of cut were measured under fixed material removal rate. The surface roughnesses at various table speed and depth of cut were obtained. The experimental results show that the grinding forces were lower at the higher table speed and lower depth of cut under same material removal rate. The surface roughnesses were worse at the higher table speed, but it was not related with depth of cut.