Cu-Sn-Zn 합금 도금의 공정 영향에 따른 특성 연구 = A study on the characteristic according process effect the Cu-Sn-Zn ternary alloy plating

다국어 초록 (Multilingual Abstract)

Cu-Sn-Zn ternary alloy plating method is studied as wet surface treatment method to substitute nickel which raises metal allergic dermatitis. Alloy plating has various problems on process controling, though it has outstanding physical and chemical characteristic. In this study, the characteristic of following co-deposition rate of Cu-Sn-Zn is discussed. It is to make ideal co-deposition rate more greater than nickel plating layer, and it will come into spotlight as new technology to substitute nickel plating.
The case, forming the ternary alloy layer, can be influenced by various processing factors. Alloy plating can be influenced on co-deposition rate by various process factors and complx effect, we could get outstanding characteristic alloy plating layer then nickel characteristic by interpreting this kind of factor characteristic. The Cu-Sn-Zn alloy plating mathod, which can replace nickel plating of physical and chemical characteristic in 58~60%Cu+30~33%Sn+7~9%Zn co-deposition rate is obtained.