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다국어 초록 (Multilingual Abstract)

Recently, due to the development of electronic devices such as flexible displays and wearable devices, research is being actively conducted on flexible and stretchable electrodes from existing rigid substrate-based electrodes. The low adhesive strength of flexible/elastic electrodes causes delamination between the electrode and the substrate along with an increase in strain rate due to repeated mechanical deformation, causing fracture of the electrode, and this adhesive strength has a significant impact on electrical performance and durability. In the case of polymer films used as substrates for flexible/stretchable electrodes, it is very difficult to have high adhesive strength with the electrode because the surface energy is very small, so surface modification is essential to improve adhesive strength. In this paper, the process of improving the adhesion between the substrate and the metal layer was studied through plasma treatment, chemical surface treatment and adsorption of bio-adhesive proteins. In addition, by controlling parameters in each process, such as surface modification method, surface treatment time, and pH of aqueous solution, we attempted to determine the effect on adhesive strength and establish process conditions for the best adhesive strength.

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목차 (Table of Contents)

목 차 1
Figure. 목차 . 3
I. 서 론 . 8
1.1 연구배경 8
1.2 연구목적 . 10

목 차 1
Figure. 목차 . 3
I. 서 론 . 8
1.1 연구배경 8
1.2 연구목적 . 10
II. 이론적 배경 11
2.1 폴리머 유연 기판 11
2.2 폴리머 기판의 표면 개질 . 13
2.2.1 플라즈마를 이용한 표면 개질 13
2.2.2 화학적 표면 개질 15
2.2.3 접합 단백질 BSA(Bovine Serum Albumin: 소혈청알부민) 16
2.3 젖음성(Wettability) . 18
2.3.1 Young’s equation. 19
2.3.2 Wenzel equation 19
2.3.3 Cassie-Baxter equation 21
2.4 접합력(Adhesion force) 22
2.5 금속 전극 형성 24
2.5.1 무전해도금 24
2.5.2 전해도금 25
2.5.3 물리기상증착(PVD) 26
2.5.4 화학기상증착(CVD) . 27
III. 실험방법 . 28
3.1 표면 개질을 통한 기판과 전극 사이의 접합력 향상 28
3.2 플라즈마에 의한 표면 처리 31
3.3 화학적 표면 처리 32
3.4 접합 단백질 BSA 흡착 33
3.5 접촉각 측정 34
3.6 접합력 평가 36
3.7 SEM (Scanning Electron Microscope) 38
3.8 AFM (Atomic Force Microscope) 39
IV. 실험결과 . 40
4.1 플라즈마 처리 가스에 따른 접합력 변화 40
4.2 플라즈마 처리 시간에 따른 접합력 변화 53
4.3 BSA 수용액의 pH에 따른 접합력 변화 . 61
4.4 PdCl2 수용액의 pH에 따른 접합력 변화 64
4.5 화학적 표면 처리에 의한 접합력 평가 67
4.6 접합력 향상 공정의 응용 . 71
4.6.1 신축성 기판의 접합력 향상 71
4.6.2 무전해니켈도금 전극의 접합력 향상 . 76
V. 결론 79
참고문헌 82
Abstract 90
감사의 글 . 91
Figure. 목차
Figure. 2.3.1 Schematic illustration of Young’s model
Figure. 2.3.2 Schematic illustration of Wenzel model
Figure. 2.3.3 Schematic illustration of Cassie-Baxter model
Figure. 3.1.1 Factors affecting adhesion in the process of improving adhesion between substrate and electrode through surface modification of flexible /stretchable substrates
Figure. 3.1.2 Schematic illustration of a process to improve the adhesion between electrodes and substrates through surface modification of flexible/stretchable substrates
Figure. 3.2.1 Image of plasma system (CIONE, Femto Science)
Figure. 3.5.1 Image of the water droplet on FEP film
Figure. 3.5.2 Image of measuring contact angle by ImageJ software
Figure. 3.6.1 Schematic illustration of the 90° peel test
Figure. 3.6.2 Image of the 90° peel test machine
Figure. 3.7.1 Image of SEM (SEC, SNE4500M)
Figure. 3.8.1 Image of AFM (Bruker, Dimension Icon Scanning Probe Microscope)
Figure. 4.1.1 Contact angle of non-treated FEP
Figure. 4.1.2 Contact angle of O2 plasma treated FEP
Figure. 4.1.3 Contact angle of Air plasma treated FEP
Figure. 4.1.4 Contact angle of Ar plasma treated FEP
Figure. 4.1.5 Contact angle of FEP film as function of plasma gas
Figure. 4.1.6 Contact angle of BSA coated FEP film after O2 plasma
Figure. 4.1.7 Contact angle of BSA coated FEP film after Air plasma
Figure. 4.1.8 Contact angle of BSA coated FEP film after Ar plasma
Figure. 4.1.9 Contact angle of BSA coated FEP film as function of plasma gas
Figure. 4.1.10 AFM image of non-treated FEP
Figure. 4.1.11 AFM image of O2 plasma treated FEP
Figure. 4.1.12 AFM image of Air plasma treated FEP
Figure. 4.1.13 AFM image of Ar plasma treated FEP
Figure. 4.1.14. Optical Images of Cu electroless plated surface on A) O2, B) Air, C) Ar plasma treated FEP
Figure. 4.1.15 Peel strength of O2 plasma treated FEP/Cu
Figure. 4.1.16 Peel strength of Air plasma treated FEP/Cu
Figure. 4.1.17 Peel strength of Ar plasma treated FEP/Cu
Figure. 4.1.18 Peel strength as function of plasma gas
Figure. 4.1.19 SEM image of peeled off surface after 90° peel test of O2 plasma treated FEP substrate and Cu layer
Figure. 4.1.20 SEM image of peeled off surface after 90° peel test of Air plasma treated FEP substrate and Cu layer
Figure. 4.1.21 SEM image of peeled off surface after 90° peel test of Ar plasma treated FEP substrate and Cu layer
Figure. 4.1.22 Optical image of peeled off surface after 90° peel test of Ar plasma treated A) FEP substrate and B) Cu layer
Figure. 4.2.1 Contact angle as function of plasma treatment time
Figure. 4.2.2 Surface roughness as function of Ar plasma treatment time
Figure. 4.2.3 AFM image of FEP treated with Ar plasma for 90s
Figure. 4.2.4 AFM image of FEP treated with Ar plasma for 180s
Figure. 4.2.5 AFM image of FEP treated with Ar plasma for 300s
Figure. 4.2.6 AFM image of FEP treated with Ar plasma for 600s
Figure. 4.2.7 Peel strength of FEP/Cu treated with Ar plasma for 90s
Figure. 4.2.8 Peel strength of FEP/Cu treated with Ar plasma for 180s
Figure. 4.2.9 Peel strength of FEP/Cu treated with Ar plasma for 300s
Figure. 4.2.10 Peel strength of FEP/Cu treated with Ar plasma for 600s
Figure. 4.2.11 Peel strength of FEP/Cu treated with Ar plasma for 1200s
Figure. 4.2.12 Peel strength as function of Ar plasma treatment time
Figure. 4.3.1 Optical images of water droplet on BSA (pH1-12) coated FEP
Figure. 4.3.2 Contact angle as function of BSA solution pH
Figure. 4.3.3 Peel strength as function of BSA solution pH
Figure. 4.4.1 Optical image of cross-liked BSA and Pd nanoparticles
Figure. 4.4.2 Optical Image of cross-liked BSA and Pd nanoparticles at pH 4
Figure. 4.4.3 Peel strength as function of Pd solution pH
Figure. 4.5.1 Optical image of Cu by chemical treated FEP A) H2SO4, B) HCI, C) NaOH, D) KOH
Figure. 4.5.2 Contact angle of chemical treated PET film
Figure. 4.5.3 Electroless plated Cu on PET after chemical surface modification by A) H2SO4, B) HCI, C) NaOH, D) KOH
Figure. 4.5.4 Optical image of Cu electroless plated on PET peeled off by 3M 810 tape test after chemical surface modification A) H2SO4, B) HCI, C) NaOH, D) KOH
Figure. 4.6.1.1 Schematic illustration of Cu electroless plating on PDMS
Figure. 4.6.1.2 Images of PDMS after peeling off Cu on PDMS with 3M 810 tape test A) bare PDMS, B) BSA coated PDMS C) BSA coated PDMS after Ar plasma
Figure. 4.6.1.3 Optical Images of the peeled-off Cu layer by 3M 810 tape test A) bare PDMS, B) BSA coated PDMS C) BSA coated PDMS after Ar plasma
Figure. 4.6.1.4 Schematic illustration of Cu electroless plating on TPU
Figure. 4.6.1.5 Optical microscope images of peeled-off Cu layer by 3M 810 tape test A) bare TPU, B) Ar plasma treated TPU C) BSA coated TPU after Ar plasma
Figure. 4.6.1.6 SEM images of Cu layer after 10% tensile test A) bare TPU, B) Ar plasma treated TPU C) BSA coated TPU after Ar plasma
Figure. 4.6.2.1 Optical image of the peeled-off Ni layer on FEP with 90° peel test
Figure. 4.6.2.2 Optical image of the peeled-off FEP with 90° peel test
Figure. 4.6.2.3 SEM image of peeled-off Ni layer on FEP with 90° peel test
Figure. 4.6.2.4 Peel strength of electroless Ni plating on FEP

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유연/신축성 기판의 표면 개질을 통한 전극과 기판 사이의 접합력 향상 연구 = Study on Enhancement of Adhesion between Electrode and Substrate Through Surface Modification of Flexible/Stretchable Substrate

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