구리-흑연 복합소재의 열전도계수 특성 모델링 = Modelling on Thermal Conductivity Characteristics of Cu-Graphite Composite Material

다국어 초록 (Multilingual Abstract)

In this study, a Cu-graphite composite is proposed as a solution to the reliability problem caused by the difference in the coefficient of thermal expansion (CTE) between chips and substrates. The thermal characteristics of the composite were investigated through the aspect ratio, arrangement, and volume fraction of fillers. ANSYS Material Designer was used to simulate the thermal conductivity (TC) of the composite material, varying the filler aspect ratio, tensor in the A11 direction, and volume fraction from 1 to 3, 0.3 to 0.6, and 0.1 to 0.3, respectively. The simulation was based on a Hot press specimen from a previous study. The results showed that increasing the content of copper filler decreased TC in the K1 and K2 directions, while it increased TC in the K3 direction. Furthermore, the study revealed the following insights: (1) decreasing the volume fraction improved TC in the K1 direction, regardless of the aspect ratio and tensor in the K1 direction; (2) low volume fraction and aspect ratio, and high tensor in the A11 direction improved TC in the K2 direction; (3) high volume fraction and aspect ratio, and low A11 tensor improved TC in the K3 direction. This study demonstrated the effectiveness of a Cu-graphite composite in improving the reliability of chips and substrates by controlling the thermal characteristics through the aspect ratio, arrangement, and volume fraction of fillers. The findings offer valuable insights for material designers to develop composite materials with improved thermal properties.