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      KCI등재 SCOPUS SCIE

      Improvement of electrostatic damage resistance of photomasks with conductive ITO film fabricated using UAPS (UV-Assisted-Partial-Strip) method

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      https://www.riss.kr/link?id=A107861150

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      다국어 초록 (Multilingual Abstract)

      The photomasks for contact-type lithography are vulnerable to electrostatic damage. In the present study, a conducting ITO material was introduced as a bridge between the chromium metal patterns to prevent electrostatic damage. The core of this research was to optimize the material and bridging structure to distribute the accumulated charges effi ciently. On the other hand, when fabricating the bridging circuit, it is challengeable to deposit an ITO material without electrical disconnection due to the inevitable chromium undercut shape caused by isotropic etching during the wet etching process. A method called UV-Assisted-Partial-Strip (UAPS) was adopted in this study. UAPS induces a change in the solubility and erosion properties of resistance through irradiation with 365 nm light and optimization of the alkaline solution process. Focused ion beam- scanning electron microscopy confi rmed that the conducting ITO fi lm was deposited without electrical disconnection on the side of the chromium pattern over the entire area of the photomask. ITO thin fi lm was optimized 20 nm-thick, 3.0 × 10 2  Ω/ sheet resistance, and about 84% transmittance. The subsequent hand roller test and electrostatic discharge immunity test showed that the initiation voltage of the electrostatic melted-typed defect had been increased remarkably.
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      The photomasks for contact-type lithography are vulnerable to electrostatic damage. In the present study, a conducting ITO material was introduced as a bridge between the chromium metal patterns to prevent electrostatic damage. The core of this resear...

      The photomasks for contact-type lithography are vulnerable to electrostatic damage. In the present study, a conducting ITO material was introduced as a bridge between the chromium metal patterns to prevent electrostatic damage. The core of this research was to optimize the material and bridging structure to distribute the accumulated charges effi ciently. On the other hand, when fabricating the bridging circuit, it is challengeable to deposit an ITO material without electrical disconnection due to the inevitable chromium undercut shape caused by isotropic etching during the wet etching process. A method called UV-Assisted-Partial-Strip (UAPS) was adopted in this study. UAPS induces a change in the solubility and erosion properties of resistance through irradiation with 365 nm light and optimization of the alkaline solution process. Focused ion beam- scanning electron microscopy confi rmed that the conducting ITO fi lm was deposited without electrical disconnection on the side of the chromium pattern over the entire area of the photomask. ITO thin fi lm was optimized 20 nm-thick, 3.0 × 10 2  Ω/ sheet resistance, and about 84% transmittance. The subsequent hand roller test and electrostatic discharge immunity test showed that the initiation voltage of the electrostatic melted-typed defect had been increased remarkably.

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      참고문헌 (Reference)

      1 R. C. Plumb, "Triboelectricity" 48 (48): 525-, 1971

      2 H. Tian, "Transparent, flexible, ultrathin sound source devices using indium tin oxide fi lms" 99 : 043503-, 2011

      3 박종찬, "Properties of IZTO Thin Films on Glass with Different Thickness of SiO2 Buffer Layer" 한국세라믹학회 52 (52): 290-293, 2015

      4 A. J. Steinman, "Preventing electrostatic problems in semiconductor manufacturing" 21 (21): 89-93, 2004

      5 S. Jose, "Photomask and Method for Reducing Electrostatic Discharge on the Same with an ESD Protection Pattern. US Patent, 6893780"

      6 S. Y. Lee, "Monitoring Module Including e-Field Induced ESD Sensitive Pattern, and Photomask Including the Monitoring Module. KR Patent, 10 2011 0083418"

      7 S.A. Rizvi, "Handbook of Photomask Manufacturing Technology" Taylor & Francis 19-32, 2005

      8 F. Galembeck, "Friction, tribochemistry and triboelectricity:recent progress and perspectives" 2014

      9 G. Rider, "Estimation of the fi eld induced damage thresholds in reticles" 1-9, 2004

      10 R. Cited, "Electrostatic Damage Protected Photomasks. US Patent, 6,803,156 B2"

      1 R. C. Plumb, "Triboelectricity" 48 (48): 525-, 1971

      2 H. Tian, "Transparent, flexible, ultrathin sound source devices using indium tin oxide fi lms" 99 : 043503-, 2011

      3 박종찬, "Properties of IZTO Thin Films on Glass with Different Thickness of SiO2 Buffer Layer" 한국세라믹학회 52 (52): 290-293, 2015

      4 A. J. Steinman, "Preventing electrostatic problems in semiconductor manufacturing" 21 (21): 89-93, 2004

      5 S. Jose, "Photomask and Method for Reducing Electrostatic Discharge on the Same with an ESD Protection Pattern. US Patent, 6893780"

      6 S. Y. Lee, "Monitoring Module Including e-Field Induced ESD Sensitive Pattern, and Photomask Including the Monitoring Module. KR Patent, 10 2011 0083418"

      7 S.A. Rizvi, "Handbook of Photomask Manufacturing Technology" Taylor & Francis 19-32, 2005

      8 F. Galembeck, "Friction, tribochemistry and triboelectricity:recent progress and perspectives" 2014

      9 G. Rider, "Estimation of the fi eld induced damage thresholds in reticles" 1-9, 2004

      10 R. Cited, "Electrostatic Damage Protected Photomasks. US Patent, 6,803,156 B2"

      11 C. Y. Chang, "ESD Resistant Photomask and Method if Preventing Mask ESD Damage. US Patent, 0214654 A1"

      12 이대희, "Characterizing electrical breakdowns upon reoxidation atmosphere for reliable multilayer ceramic capacitors" 한국세라믹학회 58 (58): 445-451, 2021

      13 R. Voelkel, "Advanced mask aligner lithography: new illumination system" 18 (18): 20968-, 2010

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
      2020-01-01 평가 등재학술지 유지 (해외등재 학술지 평가) KCI등재
      2010-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2008-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2006-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2004-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2001-01-01 평가 등재학술지 선정 (등재후보2차) KCI등재
      1998-07-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
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      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 0.16 0.16 0.17
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.16 0.16 0.331 0.06
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