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https://www.riss.kr/link?id=O50024203
Guilan, J. ; Gosset, L.G. ; Delsol, R. ; Brun, P. ; Ollier, E. ; Petitprez, E. ; Girault, V. ; Gras, R. ; Torres, J.
2007년
eng
학술저널
ADVANCED METALLIZATION CONFERENCE IN
17-22 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
9781558999923
Advanced metallization conference
Albany, NY
2007; Oct
0
상세조회0
다운로드
Possibilities and Problems of Self-Forming Barrier Process for Advanced LSI Metallization
A Surface Adsorption Limited Model of CoWBP Capping Barriers for sub 45 nm Cu Interconnects
Copper and Copper Oxide Composite Films Deposited by ALD on Tantalum-Based Diffusion Barriers
Electroless Deposition of NiMoPB: Electrical Performances and Material Properties