RISS 학술연구정보서비스

검색
다국어 입력

http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.

변환된 중국어를 복사하여 사용하시면 됩니다.

예시)
  • 中文 을 입력하시려면 zhongwen을 입력하시고 space를누르시면됩니다.
  • 北京 을 입력하시려면 beijing을 입력하시고 space를 누르시면 됩니다.
닫기
    인기검색어 순위 펼치기

    RISS 인기검색어

      KCI등재 SCI SCIE SCOPUS

      Theoretical and experimental analysis of a venting clip to reduce stray inductance in high‐power conversion applications

      한글로보기

      https://www.riss.kr/link?id=A107937425

      • 0

        상세조회
      • 0

        다운로드
      서지정보 열기
      • 내보내기
      • 내책장담기
      • 공유하기
      • 오류접수

      부가정보

      다국어 초록 (Multilingual Abstract)

      In this study, we present a venting clip for high‐power applications that is intended to reduce stray inductance. To reduce the stray inductance of packages in high‐power applications, the proposed venting clip features slots are inserted onto a c...

      In this study, we present a venting clip for high‐power applications that is intended to reduce stray inductance. To reduce the stray inductance of packages in high‐power applications, the proposed venting clip features slots are inserted onto a conventional clip. A conventional clip and the proposed venting clip were designed and fabricated to compare the respective stray inductance. The inductance of the proposed venting clip was approximately 15.8% than that of the conventional clip at a frequency of 100 kHz. Through a comparison between the conventional and venting clips, it is confirmed that the proposed venting clip is superior for high‐power applications in terms of decreasing inductance. With reduced inductance, the switching‐loss for such applications is also expected to decrease. Moreover, the impedance of the venting clip decreased by approximately 15.5% compared with that of the conventional clip at a frequency of 100 kHz. The venting clip, which has reduced resistive component, is also expected to decrease conduction loss in high‐power applications.

      더보기

      참고문헌 (Reference)

      1 R. P. Wojda, "Winding resistance and power loss inductors with litz and solid-round wires" 54 (54): 3548-3557, 2018

      2 Q. Zhu, "Thermal characterization of copper-clip-bonded IGBT module with double sided cooling" 1-6, 2017

      3 H. Shinagawa, "Theoretical analysis of AC resistance in coil using magnetoplated wire" 45 (45): 3251-3259, 2009

      4 Z. Zhang, "Switching loss analysis considering parasitic loop inductance with current source drivers for buck converters" 26 (26): 1815-1819, 2011

      5 M. J. Sathik, "Switched-capacitor multilevel inverter with self-voltage-balancing for high-frequency power distribution system" 13 (13): 1807-1818, 2020

      6 H. Wang, "Power semiconductor device figure of merit for high-power-density converter design applications" 55 (55): 446-470, 2008

      7 정동윤, "Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss" 한국전자통신연구원 39 (39): 866-873, 2017

      8 G. Galli, "Paschen’s law in extreme pressure and temperature conditions" 47 (47): 1641-1647, 2019

      9 B. Zhang, "Parasitic inductance modeling and reduction for wire-bonded half-bridge SiC multichip power module" 36 (36): 5892-5903, 2021

      10 T. Meade, "Parasitic inductance effects on Switching losses for a high frequency DC-DC converter" 3-9, 2008

      1 R. P. Wojda, "Winding resistance and power loss inductors with litz and solid-round wires" 54 (54): 3548-3557, 2018

      2 Q. Zhu, "Thermal characterization of copper-clip-bonded IGBT module with double sided cooling" 1-6, 2017

      3 H. Shinagawa, "Theoretical analysis of AC resistance in coil using magnetoplated wire" 45 (45): 3251-3259, 2009

      4 Z. Zhang, "Switching loss analysis considering parasitic loop inductance with current source drivers for buck converters" 26 (26): 1815-1819, 2011

      5 M. J. Sathik, "Switched-capacitor multilevel inverter with self-voltage-balancing for high-frequency power distribution system" 13 (13): 1807-1818, 2020

      6 H. Wang, "Power semiconductor device figure of merit for high-power-density converter design applications" 55 (55): 446-470, 2008

      7 정동윤, "Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss" 한국전자통신연구원 39 (39): 866-873, 2017

      8 G. Galli, "Paschen’s law in extreme pressure and temperature conditions" 47 (47): 1641-1647, 2019

      9 B. Zhang, "Parasitic inductance modeling and reduction for wire-bonded half-bridge SiC multichip power module" 36 (36): 5892-5903, 2021

      10 T. Meade, "Parasitic inductance effects on Switching losses for a high frequency DC-DC converter" 3-9, 2008

      11 P. Nayak, "Parasitic inductance and capacitanceassisted active gate driving technique to minimize switching loss of SiC MOSFET" 64 (64): 8288-8298, 2017

      12 L. Ying, "Numerical and experimental analysis of AC loss of YBCO coated conductor carrying DC and AC offet transport current" 23 (23): 1-4, 2013

      13 D. Y. Jung, "Multi-layer ceramic-based surface mount device packaging for 1200 V and 1700 V SiC SBD power semiconductor" 603-606, 2020

      14 L. Liu, "Investigation on copper clip bonding structure for power package" 1042-1046, 2018

      15 F. Yang, "Interleaved critical mode boost PFC converter with coupled inductor" 26 (26): 2404-2413, 2011

      16 C. D. Meyer, "Influence of layer thickness on the performance of stacked thick-film copper air-core power inductors" 48 (48): 4436-4439, 2012

      17 F. W. Grover, "Inductance Calculation" Dover Publication 2009

      18 H. Johnson, "High-Speed Signal Propagation" Pearson 2003

      19 W. Meng, "High dv/dt noise modeling and reduction on control circuits of GaN-based full bridge inverters" 34 (34): 12246-12261, 2019

      20 C. Chen, "Flexible PCB-based 3-D integrated SiC halfbridge power module with three-sided cooling using ultralow inductive hybrid packaging structure" 34 (34): 5579-5593, 2019

      21 T. Wang, "Fast and accurate frequency-dependent behavioral model of bonding wires" 13 (13): 2389-2396, 2017

      22 F. Yang, "Electrical performance advancement in SiC power module package design with Kelvin drain connection and low parasitic inductance" 7 : 84-98, 2019

      23 M. D. Xu, "Editorial special issue on green power supplies" 4 (4): 333-334, 2016

      24 H. Shigekane, "Developments in modern high power semiconductor devices" 16-21, 1993

      25 장우진, "Design of Parasitic Inductance Reduction in GaN Cascode FET for High-Efficiency Operation" 한국전자통신연구원 38 (38): 133-140, 2016

      26 Y. Su, "Design and evaluation of a highfrequency LTCC inductor substrate for a three-dimensional integrated DC/DC converter" 28 (28): 4354-4364, 2013

      27 H. Cha, "Design and development of high-power DC-DC converter for metro vehicle system" 44 (44): 1795-1804, 2008

      28 정동윤, "Design and Evaluation of Cascode GaN FET for Switching Power Conversion Systems" 한국전자통신연구원 39 (39): 62-68, 2017

      29 T. Sugimoto, "Corona and spark discharges occurring between a grounded sphere and an array of charged multiple electrodes" 42 (42): 881-886, 2006

      30 K. K. Lwin, "Copper clip package for high performance MOSFETs" 123-128, 2016

      31 Y. Chang, "Compact sandwiched press-pack SiC power module with low stray inductance and balanced thermal stress" 35 (35): 2237-2241, 2020

      32 S. Pekarek, "Atmospheric-air needle-to-cylinder DC discharges in magnetic field" 39 (39): 2206-2207, 2011

      33 L. Yu, "A split-field-windings doubly salient brushless DC generator with reduced excitation capacity for hybrid electric vehicles" 65 (65): 7697-7708, 2018

      34 R. Javidi, "A new method of measuring winding AC resistance of high-efficiency power inductors" 33 (33): 10736-10747, 2018

      35 K. Wang, "A multiloop method for minimization of parasitic inductance in GaN-based high-frequency DC-DC converter" 32 (32): 4728-4740, 2017

      36 D. Atanu, "A module-level springinterconnected stack power module" 9 (9): 88-95, 2019

      37 A. B. Jørgensen, "A fast-switching integrated full-bridge power module based on GaN eHEMT devices" 34 (34): 2494-2504, 2019

      더보기

      동일학술지(권/호) 다른 논문

      동일학술지 더보기

      더보기

      분석정보

      View

      상세정보조회

      0

      Usage

      원문다운로드

      0

      대출신청

      0

      복사신청

      0

      EDDS신청

      0

      동일 주제 내 활용도 TOP

      더보기

      주제

      연도별 연구동향

      연도별 활용동향

      연관논문

      연구자 네트워크맵

      공동연구자 (7)

      유사연구자 (20) 활용도상위20명

      인용정보 인용지수 설명보기

      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
      2020-01-01 평가 등재학술지 유지 (해외등재 학술지 평가) KCI등재
      2005-09-27 학술지등록 한글명 : ETRI Journal
      외국어명 : ETRI Journal
      KCI등재
      2003-01-01 평가 SCI 등재 (신규평가) KCI등재
      더보기

      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 0.78 0.28 0.57
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.47 0.42 0.4 0.06
      더보기

      이 자료와 함께 이용한 RISS 자료

      나만을 위한 추천자료

      해외이동버튼