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2 Q. Zhu, "Thermal characterization of copper-clip-bonded IGBT module with double sided cooling" 1-6, 2017
3 H. Shinagawa, "Theoretical analysis of AC resistance in coil using magnetoplated wire" 45 (45): 3251-3259, 2009
4 Z. Zhang, "Switching loss analysis considering parasitic loop inductance with current source drivers for buck converters" 26 (26): 1815-1819, 2011
5 M. J. Sathik, "Switched-capacitor multilevel inverter with self-voltage-balancing for high-frequency power distribution system" 13 (13): 1807-1818, 2020
6 H. Wang, "Power semiconductor device figure of merit for high-power-density converter design applications" 55 (55): 446-470, 2008
7 정동윤, "Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss" 한국전자통신연구원 39 (39): 866-873, 2017
8 G. Galli, "Paschen’s law in extreme pressure and temperature conditions" 47 (47): 1641-1647, 2019
9 B. Zhang, "Parasitic inductance modeling and reduction for wire-bonded half-bridge SiC multichip power module" 36 (36): 5892-5903, 2021
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