RISS 학술연구정보서비스

검색
다국어 입력

http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.

변환된 중국어를 복사하여 사용하시면 됩니다.

예시)
  • 中文 을 입력하시려면 zhongwen을 입력하시고 space를누르시면됩니다.
  • 北京 을 입력하시려면 beijing을 입력하시고 space를 누르시면 됩니다.
닫기
    인기검색어 순위 펼치기

    RISS 인기검색어

      KCI등재 SCIE SCOPUS

      Bidirectional Transient Voltage Suppression Diodes for the Protection of High Speed Data Line from Electrostatic Discharge Shocks

      한글로보기

      https://www.riss.kr/link?id=A99919224

      • 0

        상세조회
      • 0

        다운로드
      서지정보 열기
      • 내보내기
      • 내책장담기
      • 공유하기
      • 오류접수

      부가정보

      다국어 초록 (Multilingual Abstract)

      A bidirectional transient voltage suppression (TVS) diode consisting of specially designed p--n++-p-multi-junctions was developed using low temperature (LT) epitaxy and fabrication processes. Its electrostatic discharge (ESD) performance was investigated using IV, C-V, and various ESD tests including the human body model (HBM), machine model (MM) and IEC 61000-4-2 (IEC) analysis. The symmetrical structure with very sharp and uniform bidirectional multijunctions yields good symmetrical I-V behavior over a wide range of operating temperature of 300 K ? 450 K and low capacitance as 6.9 pF at 1 MHz. In addition, a very thin and heavily doped n++ layer enabled I-V curves steep rise after breakdown without snapback phenomenon, then resulted in small dynamic resistance as 0.2 ;, and leakage current completely suppressed down to pA. Manufactured bidirectional TVS diodes were capable of withstanding ± 4.0 kV of MM and ± 14 kV of IEC, and exceeding ± 8 kV of HBM, while maintaining reliable I-V characteristics. Such an excellent ESD performance of low capacitance and dynamic resistance is attributed to the abruptness and very unique profiles designed very precisely in p-n++p-multi-junctions.
      번역하기

      A bidirectional transient voltage suppression (TVS) diode consisting of specially designed p--n++-p-multi-junctions was developed using low temperature (LT) epitaxy and fabrication processes. Its electrostatic discharge (ESD) performance was investiga...

      A bidirectional transient voltage suppression (TVS) diode consisting of specially designed p--n++-p-multi-junctions was developed using low temperature (LT) epitaxy and fabrication processes. Its electrostatic discharge (ESD) performance was investigated using IV, C-V, and various ESD tests including the human body model (HBM), machine model (MM) and IEC 61000-4-2 (IEC) analysis. The symmetrical structure with very sharp and uniform bidirectional multijunctions yields good symmetrical I-V behavior over a wide range of operating temperature of 300 K ? 450 K and low capacitance as 6.9 pF at 1 MHz. In addition, a very thin and heavily doped n++ layer enabled I-V curves steep rise after breakdown without snapback phenomenon, then resulted in small dynamic resistance as 0.2 ;, and leakage current completely suppressed down to pA. Manufactured bidirectional TVS diodes were capable of withstanding ± 4.0 kV of MM and ± 14 kV of IEC, and exceeding ± 8 kV of HBM, while maintaining reliable I-V characteristics. Such an excellent ESD performance of low capacitance and dynamic resistance is attributed to the abruptness and very unique profiles designed very precisely in p-n++p-multi-junctions.

      더보기

      목차 (Table of Contents)

      • Abstract
      • Ⅰ. INTRODUCTION
      • Ⅱ. EXPERIMENTAL PROCEDURE
      • Ⅲ. RESULTS AND DISCUSSION
      • Ⅳ. CONCLUSIONS
      • Abstract
      • Ⅰ. INTRODUCTION
      • Ⅱ. EXPERIMENTAL PROCEDURE
      • Ⅲ. RESULTS AND DISCUSSION
      • Ⅳ. CONCLUSIONS
      • REFERENCES
      더보기

      참고문헌 (Reference)

      1 D. de Cogan, "The punch-through diode" 8 (8): 20-23, 1977

      2 A. Amerasekera, "The Impact of Technology Scalingon ESD Robustness and Protection Circuit Design" 18 (18): 314-320, 1995

      3 Ya-Chin King, "Punchthrough diode as the transient voltage suppressor for low-voltage electronics" 43 (43): 2037-2040, 1996

      4 Ya-Chin King, "Punchthrough Transient Voltage Suppressor for Low-Voltage Electronics" 16 (16): 303-305, 1995

      5 D. de Cogan, "Punch-through diode as a power device" 127 (127): 67-71, 1980

      6 J. Lohstroh, "Punch-through currents in p+np+ and n+pn+ sandwich structures" 24 (24): 804-820, 1981

      7 P. Renaud, "High robustness PNP-based structure for the ESD protection of high voltage I/Os in an advanced smart power technology" 226-229, 2007

      8 C. Duvvury, "Handbook of Failure Modes, Reliability Issues, and Case Studies, ESD in Silicon Integrated Circuits" John Wiley & Sons, Ltd 228-272, 2002

      9 Michel Mardiguian, "Electrostatic Discharge, understand, simulate, and fix ESD problems" John Wiley & Sons, Inc 30-, 2009

      10 J. E. Vinson, "Electrostatic Discharge in Semiconductor Devices: An Overview" 86 (86): 399-420, 1998

      1 D. de Cogan, "The punch-through diode" 8 (8): 20-23, 1977

      2 A. Amerasekera, "The Impact of Technology Scalingon ESD Robustness and Protection Circuit Design" 18 (18): 314-320, 1995

      3 Ya-Chin King, "Punchthrough diode as the transient voltage suppressor for low-voltage electronics" 43 (43): 2037-2040, 1996

      4 Ya-Chin King, "Punchthrough Transient Voltage Suppressor for Low-Voltage Electronics" 16 (16): 303-305, 1995

      5 D. de Cogan, "Punch-through diode as a power device" 127 (127): 67-71, 1980

      6 J. Lohstroh, "Punch-through currents in p+np+ and n+pn+ sandwich structures" 24 (24): 804-820, 1981

      7 P. Renaud, "High robustness PNP-based structure for the ESD protection of high voltage I/Os in an advanced smart power technology" 226-229, 2007

      8 C. Duvvury, "Handbook of Failure Modes, Reliability Issues, and Case Studies, ESD in Silicon Integrated Circuits" John Wiley & Sons, Ltd 228-272, 2002

      9 Michel Mardiguian, "Electrostatic Discharge, understand, simulate, and fix ESD problems" John Wiley & Sons, Inc 30-, 2009

      10 J. E. Vinson, "Electrostatic Discharge in Semiconductor Devices: An Overview" 86 (86): 399-420, 1998

      11 B. Jeppesen, "Electrostatic Discharge Specifications and protection Methods" 134-137, 1998

      12 A. G. Chynoweth, "Effect of dislocations on breakdown in silicon p-n junctions" 29 (29): 1103-1110, 1958

      13 D. Bouangeune, "ESD robustness of lowvoltage/high-speed TVS devices with epitaxial grown films" 189-192, 2012

      14 S. S. Choi, "Development of Transient Voltage Suppressor Device with Abrupt Junctions Embedded by Epitaxial Growth Technology" 대한금속·재료학회 5 (5): 59-62, 2009

      15 J. A. Salcedo, "Bidirectional Devices for Automotive-Grade Electrostatic Discharge Applications" 33 (33): 860-862, 2012

      16 Zhiwei Liu, "An Improved Bidirectional SCR Structure for Low-Triggering ESD Protection Applications" 29 (29): 360-362, 2008

      더보기

      동일학술지(권/호) 다른 논문

      분석정보

      View

      상세정보조회

      0

      Usage

      원문다운로드

      0

      대출신청

      0

      복사신청

      0

      EDDS신청

      0

      동일 주제 내 활용도 TOP

      더보기

      주제

      연도별 연구동향

      연도별 활용동향

      연관논문

      연구자 네트워크맵

      공동연구자 (7)

      유사연구자 (20) 활용도상위20명

      인용정보 인용지수 설명보기

      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
      2020-01-01 평가 등재학술지 유지 (해외등재 학술지 평가) KCI등재
      2014-01-21 학회명변경 영문명 : The Institute Of Electronics Engineers Of Korea -> The Institute of Electronics and Information Engineers KCI등재
      2010-11-25 학술지명변경 한글명 : JOURNAL OF SEMICONDUTOR TECHNOLOGY AND SCIENCE -> JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE KCI등재
      2010-01-01 평가 등재학술지 선정 (등재후보2차) KCI등재
      2009-01-01 평가 등재후보 1차 PASS (등재후보1차) KCI등재후보
      2007-01-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
      더보기

      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 0.42 0.13 0.35
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.3 0.29 0.308 0.03
      더보기

      이 자료와 함께 이용한 RISS 자료

      나만을 위한 추천자료

      해외이동버튼