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    Bidirectional Transient Voltage Suppression Diodes for the Protection of High Speed Data Line from Electrostatic Discharge Shocks

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    https://www.riss.kr/link?id=A99919224

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    다국어 초록 (Multilingual Abstract) kakao i 다국어 번역

    A bidirectional transient voltage suppression (TVS) diode consisting of specially designed p--n++-p-multi-junctions was developed using low temperature (LT) epitaxy and fabrication processes. Its electrostatic discharge (ESD) performance was investigated using IV, C-V, and various ESD tests including the human body model (HBM), machine model (MM) and IEC 61000-4-2 (IEC) analysis. The symmetrical structure with very sharp and uniform bidirectional multijunctions yields good symmetrical I-V behavior over a wide range of operating temperature of 300 K ? 450 K and low capacitance as 6.9 pF at 1 MHz. In addition, a very thin and heavily doped n++ layer enabled I-V curves steep rise after breakdown without snapback phenomenon, then resulted in small dynamic resistance as 0.2 ;, and leakage current completely suppressed down to pA. Manufactured bidirectional TVS diodes were capable of withstanding ± 4.0 kV of MM and ± 14 kV of IEC, and exceeding ± 8 kV of HBM, while maintaining reliable I-V characteristics. Such an excellent ESD performance of low capacitance and dynamic resistance is attributed to the abruptness and very unique profiles designed very precisely in p-n++p-multi-junctions.
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    A bidirectional transient voltage suppression (TVS) diode consisting of specially designed p--n++-p-multi-junctions was developed using low temperature (LT) epitaxy and fabrication processes. Its electrostatic discharge (ESD) performance was investiga...

    A bidirectional transient voltage suppression (TVS) diode consisting of specially designed p--n++-p-multi-junctions was developed using low temperature (LT) epitaxy and fabrication processes. Its electrostatic discharge (ESD) performance was investigated using IV, C-V, and various ESD tests including the human body model (HBM), machine model (MM) and IEC 61000-4-2 (IEC) analysis. The symmetrical structure with very sharp and uniform bidirectional multijunctions yields good symmetrical I-V behavior over a wide range of operating temperature of 300 K ? 450 K and low capacitance as 6.9 pF at 1 MHz. In addition, a very thin and heavily doped n++ layer enabled I-V curves steep rise after breakdown without snapback phenomenon, then resulted in small dynamic resistance as 0.2 ;, and leakage current completely suppressed down to pA. Manufactured bidirectional TVS diodes were capable of withstanding ± 4.0 kV of MM and ± 14 kV of IEC, and exceeding ± 8 kV of HBM, while maintaining reliable I-V characteristics. Such an excellent ESD performance of low capacitance and dynamic resistance is attributed to the abruptness and very unique profiles designed very precisely in p-n++p-multi-junctions.

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    목차 (Table of Contents)

    • Abstract
    • Ⅰ. INTRODUCTION
    • Ⅱ. EXPERIMENTAL PROCEDURE
    • Ⅲ. RESULTS AND DISCUSSION
    • Ⅳ. CONCLUSIONS
    • Abstract
    • Ⅰ. INTRODUCTION
    • Ⅱ. EXPERIMENTAL PROCEDURE
    • Ⅲ. RESULTS AND DISCUSSION
    • Ⅳ. CONCLUSIONS
    • REFERENCES
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    참고문헌 (Reference)

    1 D. de Cogan, "The punch-through diode" 8 (8): 20-23, 1977

    2 A. Amerasekera, "The Impact of Technology Scalingon ESD Robustness and Protection Circuit Design" 18 (18): 314-320, 1995

    3 Ya-Chin King, "Punchthrough diode as the transient voltage suppressor for low-voltage electronics" 43 (43): 2037-2040, 1996

    4 Ya-Chin King, "Punchthrough Transient Voltage Suppressor for Low-Voltage Electronics" 16 (16): 303-305, 1995

    5 D. de Cogan, "Punch-through diode as a power device" 127 (127): 67-71, 1980

    6 J. Lohstroh, "Punch-through currents in p+np+ and n+pn+ sandwich structures" 24 (24): 804-820, 1981

    7 P. Renaud, "High robustness PNP-based structure for the ESD protection of high voltage I/Os in an advanced smart power technology" 226-229, 2007

    8 C. Duvvury, "Handbook of Failure Modes, Reliability Issues, and Case Studies, ESD in Silicon Integrated Circuits" John Wiley & Sons, Ltd 228-272, 2002

    9 Michel Mardiguian, "Electrostatic Discharge, understand, simulate, and fix ESD problems" John Wiley & Sons, Inc 30-, 2009

    10 J. E. Vinson, "Electrostatic Discharge in Semiconductor Devices: An Overview" 86 (86): 399-420, 1998

    1 D. de Cogan, "The punch-through diode" 8 (8): 20-23, 1977

    2 A. Amerasekera, "The Impact of Technology Scalingon ESD Robustness and Protection Circuit Design" 18 (18): 314-320, 1995

    3 Ya-Chin King, "Punchthrough diode as the transient voltage suppressor for low-voltage electronics" 43 (43): 2037-2040, 1996

    4 Ya-Chin King, "Punchthrough Transient Voltage Suppressor for Low-Voltage Electronics" 16 (16): 303-305, 1995

    5 D. de Cogan, "Punch-through diode as a power device" 127 (127): 67-71, 1980

    6 J. Lohstroh, "Punch-through currents in p+np+ and n+pn+ sandwich structures" 24 (24): 804-820, 1981

    7 P. Renaud, "High robustness PNP-based structure for the ESD protection of high voltage I/Os in an advanced smart power technology" 226-229, 2007

    8 C. Duvvury, "Handbook of Failure Modes, Reliability Issues, and Case Studies, ESD in Silicon Integrated Circuits" John Wiley & Sons, Ltd 228-272, 2002

    9 Michel Mardiguian, "Electrostatic Discharge, understand, simulate, and fix ESD problems" John Wiley & Sons, Inc 30-, 2009

    10 J. E. Vinson, "Electrostatic Discharge in Semiconductor Devices: An Overview" 86 (86): 399-420, 1998

    11 B. Jeppesen, "Electrostatic Discharge Specifications and protection Methods" 134-137, 1998

    12 A. G. Chynoweth, "Effect of dislocations on breakdown in silicon p-n junctions" 29 (29): 1103-1110, 1958

    13 D. Bouangeune, "ESD robustness of lowvoltage/high-speed TVS devices with epitaxial grown films" 189-192, 2012

    14 S. S. Choi, "Development of Transient Voltage Suppressor Device with Abrupt Junctions Embedded by Epitaxial Growth Technology" 대한금속·재료학회 5 (5): 59-62, 2009

    15 J. A. Salcedo, "Bidirectional Devices for Automotive-Grade Electrostatic Discharge Applications" 33 (33): 860-862, 2012

    16 Zhiwei Liu, "An Improved Bidirectional SCR Structure for Low-Triggering ESD Protection Applications" 29 (29): 360-362, 2008

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