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      KCI등재후보 SCOPUS

      The Methodology of Systematic Global Calibration for Process Simulator

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      https://www.riss.kr/link?id=A103967778

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      다국어 초록 (Multilingual Abstract)

      This paper proposes a novel methodology of systematic global calibration and validates its accuracy and efficiency with application to memory and logic devices. With 175 SIMS profiles which cover the range of conditions of implant and diffusion proces...

      This paper proposes a novel methodology of systematic global calibration and validates its accuracy and efficiency with application to memory and logic devices. With 175 SIMS profiles which cover the range of conditions of implant and diffusion processes in the fabrication lines, the dominant diffusion phenomenon in each process temperature region has been determined. Using the dual-pearson implant model and fully-coupled diffusion model, the calibration was performed systematically. We applied the globally calibrated process simulator parameters to memory and logic devices to predict the optimum process conditions for target device characteristics.

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      참고문헌 (Reference)

      1 "Systematic calibration of process simulators for predictive TCAD" SISPAD '97 273-, 1997.

      2 "Reverse short-channel effect due to lateral diffusion of point-defect induced by source/drain ion implantation IEEE Trans. on CAD" 134 : 507-, 1994.

      3 "Modeling of the ostwald ripening of extrinsic defects and transient enhanced diffusion in silicon Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms" 186 : 281-, 2002.

      4 "Issues on boron electrical activation in silicon Experiments on boron clusters and shallow junctions formation Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms" 186 : 246-, 2002.

      5 "Fundamental diffusion issues for deep-submicron device processing" IEDM 99 333-99, 1999.

      6 "First-principles study of the atomic structure of B-related defects in crystalline Si predoped with phosphorus" 340 : 561-, 2003.

      7 "Effects of deposition temperature and annealing process on PZT thin films prepared by pulsed laser deposition" 3 (3): 14-, 2002.

      8 "Effect of the Ge preamorphization dose on boron diffusion and defect evolution in silicon Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms" 186 : 276-, 2002.

      9 "Diffusion simula-tions of boron implanted at low energy Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms" 216 : 303-, 2004.

      10 "Depth dependence of defect evolution and TED during annealing Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms" 216 : 90-, 2004.

      1 "Systematic calibration of process simulators for predictive TCAD" SISPAD '97 273-, 1997.

      2 "Reverse short-channel effect due to lateral diffusion of point-defect induced by source/drain ion implantation IEEE Trans. on CAD" 134 : 507-, 1994.

      3 "Modeling of the ostwald ripening of extrinsic defects and transient enhanced diffusion in silicon Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms" 186 : 281-, 2002.

      4 "Issues on boron electrical activation in silicon Experiments on boron clusters and shallow junctions formation Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms" 186 : 246-, 2002.

      5 "Fundamental diffusion issues for deep-submicron device processing" IEDM 99 333-99, 1999.

      6 "First-principles study of the atomic structure of B-related defects in crystalline Si predoped with phosphorus" 340 : 561-, 2003.

      7 "Effects of deposition temperature and annealing process on PZT thin films prepared by pulsed laser deposition" 3 (3): 14-, 2002.

      8 "Effect of the Ge preamorphization dose on boron diffusion and defect evolution in silicon Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms" 186 : 276-, 2002.

      9 "Diffusion simula-tions of boron implanted at low energy Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms" 216 : 303-, 2004.

      10 "Depth dependence of defect evolution and TED during annealing Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms" 216 : 90-, 2004.

      11 "Anomalous subthreshold characteristics of shallow trench - isolated submicron NMOSFET with capped p - TEOS / SiN" 3 (3): 18-, 2002.

      12 "A novel TCAD database system with efficient handling capability on measured and simulated data" SISPAD '97 265-, 1997.

      13 "A calibrated model for trap-ping of implanted dopants at material interface during thermal annealing" IEDM 99 509-99, 1999.

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
      2020-01-01 평가 등재학술지 유지 (해외등재 학술지 평가) KCI등재
      2011-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2009-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2006-01-01 평가 등재학술지 선정 (등재후보2차) KCI등재
      2005-05-30 학회명변경 영문명 : 미등록 -> The Korean Institute of Electrical and Electronic Material Engineers KCI등재후보
      2005-05-30 학술지명변경 한글명 : Transactions on Electrical and Electroni -> Transactions on Electrical and Electronic Materials KCI등재후보
      2005-01-01 평가 등재후보 1차 PASS (등재후보1차) KCI등재후보
      2003-01-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
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      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 0.08 0.08 0.1
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.1 0.11 0.239 0.07
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