Flip-chip 본딩 장비 제작 및 공정조건 최적화 = Bonding process parameter optimization of flip-chip bonder

다국어 초록 (Multilingual Abstract)

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF. In bonding process, the bonding force and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flipchip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed for two types of flipchips with different chip size and lead pitch. The bonding temperatures are chosen between 25℃ to 300℃. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

목차 (Table of Contents)

• ABSTRACT
• 1. 서론
• 2. 플립칩 패키징 공정
• 3. 시스템을 이용한 Flip-chip bonding 공정
• 4. 결론
• 후기
• 참고문헌