1 윤정원, "전자 패키징의 요소기술" 대한용접접합학회 23 (23): 10-17, 2005
2 김종웅, "전도성 접착제를 이용한 패키징 기술" 한국마이크로전자및패키징학회 16 (16): 1-9, 2009
3 J. B. Lee, "Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)" Taylor & Francis 85 (85): 341-350, 2009
4 최정현, "Sn-Pb 솔더를 이용한 경연성 인쇄 회로 기판간의 열압착 본딩" 한국마이크로전자및패키징학회 17 (17): 11-15, 2010
5 D. R. Frear, "Pb-free solders for flip-chip interconnects" JOM. J. Minerals, Met. 53 (53): 28-, 2001
6 Judith Glazer, "Mictrostructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly" J. Electron. 23 (23): 693-, 1994
7 J. W. Yoon, "Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu (ENIG) sandwich solder joints" 448 (448): 177-, 2008
8 J. M. Koo, "Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate" INST PURE APPLIED PHYSICS 47 (47): 4309-4313, 2008
9 J. W. Yoon, "Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus content" 84 (84): 2552-, 2007
10 구자명, "CMOS 이미지 센서용 Au 플립칩 범프의 초음파 접합" 한국마이크로전자및패키징학회 14 (14): 19-26, 2007
1 윤정원, "전자 패키징의 요소기술" 대한용접접합학회 23 (23): 10-17, 2005
2 김종웅, "전도성 접착제를 이용한 패키징 기술" 한국마이크로전자및패키징학회 16 (16): 1-9, 2009
3 J. B. Lee, "Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)" Taylor & Francis 85 (85): 341-350, 2009
4 최정현, "Sn-Pb 솔더를 이용한 경연성 인쇄 회로 기판간의 열압착 본딩" 한국마이크로전자및패키징학회 17 (17): 11-15, 2010
5 D. R. Frear, "Pb-free solders for flip-chip interconnects" JOM. J. Minerals, Met. 53 (53): 28-, 2001
6 Judith Glazer, "Mictrostructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly" J. Electron. 23 (23): 693-, 1994
7 J. W. Yoon, "Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu (ENIG) sandwich solder joints" 448 (448): 177-, 2008
8 J. M. Koo, "Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate" INST PURE APPLIED PHYSICS 47 (47): 4309-4313, 2008
9 J. W. Yoon, "Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus content" 84 (84): 2552-, 2007
10 구자명, "CMOS 이미지 센서용 Au 플립칩 범프의 초음파 접합" 한국마이크로전자및패키징학회 14 (14): 19-26, 2007