Electrochemical Deposition of Metal Ions as a Low Energy Alternative to Conventional Methods

다국어 초록 (Multilingual Abstract)

Electrochemical infiltration of copper in porous graphite and silicon carbide is reported. A theoretical model based on Butler-Volmer equation was made to predict reaction rates across the porous preforms. Electrolytic infiltration was carried out on laser sintered graphite and silicon carbide parts using a flow through set up. The operating parameters of the laser sintering process were changed to increase porosity. Results of infiltration experiments were compared with electrolytic infiltration of graphite felt under same conditions. Triton X-100 was used as a wetting agent to improve the wettability of the porous parts with the electrolyte. It was found that a high conductivity electrolyte is required for uniform distribution of copper inside the pore network of the porous graphite and silicon carbide. Electrodeposition was carried out at small currents to avoid high potential drop and hydrogen evolution reaction during the deposition process. The electrolyte was flowed through the porous parts to achieve steady state conditions. The electrolytic infiltration process resulted in reduction of porosity fraction in graphite felt by 26% and 14% in 84% porous graphite. This study shows that electrochemical deposition of metals in the pore network of a highly porous material is possible.

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