유연 솔더와 무연 솔더의 온도변화에 따른 열변형 특성

다국어 초록 (Multilingual Abstract)

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of a specimen with controlled solder geometry are characterized by high-sensitivity moire interferometry. A shear specimen which has bi-material joint configuration is designed and fabricated to be tested with the conduction based apparatus. Experiments are conducted for the shear specimens with Sn-Pb and lead-free solder joints. Using real-time moire interferometry setup, fringe patterns are recorded and analyzed for several temperatures. The deformation of solder joint is documented at a controlled ramp rate over several thermal cycles. The experimental results are analyzed and compared with those of finite element analysis to investigate the validity of solder material models avaliable in the literatures.

목차 (Table of Contents)

• Abstract
• 1. 서론
• 2. 실험 및 해석 방법
• 3. 실험결과
• 4. 결론
• 후기
• 참고문헌