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https://www.riss.kr/link?id=O42200989
2004년
eng
0569-5503
2377-5726
학술저널
ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE
1701-1705 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0780383656; 0780383664
Electronic components and technology conference; 54th electronic components & technology conference.: 2004 proceedings
54th
Las Vegas, NV
2004
0
상세조회0
다운로드
Development of a New Improved High Performance Flip Chip BGA Package
Investigation of Cu Stud Bumping for Single Chip Flip-Chip Assembly
Qualification of an Enhanced Ball Grid Array Package Using Build-up Layers on a Metal Heat Spreader