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      잉크젯 프린팅 공정에 의한 유전체 후막의 제조 및 특성 = Structure and Properties of Polymer Infiltrated Alumina Thick film via Inkjet Printing Process

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      https://www.riss.kr/link?id=A101053260

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      다국어 초록 (Multilingual Abstract)

      We have successfully fabricated the alumina thick films using inkjet printing processes without a high temperature sintering process. Alumina suspension as dielectric ink was formulated by combining nano-sized alumina powders with an anionic polymer dispersant in formamide/water as co-solvent. The thickness of the printed alumina thick film was measured at around 5 um by field emission scanning electron microscope. The calculated packing density of 68.5 % from the printed alumina thick film was much higher than the same films fabricated by conventional casting or dip coating processes. Q factor of the dielectrics thick film infiltrated with cyanate ester resin was evaluated by impedance analyzer.
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      We have successfully fabricated the alumina thick films using inkjet printing processes without a high temperature sintering process. Alumina suspension as dielectric ink was formulated by combining nano-sized alumina powders with an anionic polymer d...

      We have successfully fabricated the alumina thick films using inkjet printing processes without a high temperature sintering process. Alumina suspension as dielectric ink was formulated by combining nano-sized alumina powders with an anionic polymer dispersant in formamide/water as co-solvent. The thickness of the printed alumina thick film was measured at around 5 um by field emission scanning electron microscope. The calculated packing density of 68.5 % from the printed alumina thick film was much higher than the same films fabricated by conventional casting or dip coating processes. Q factor of the dielectrics thick film infiltrated with cyanate ester resin was evaluated by impedance analyzer.

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      참고문헌 (Reference)

      1 J. Gurauskis, "Tape casting of Y-TZP with low binder content" 33 : 1099-, 2007

      2 B. Derby, "Inkjet printing of highly loaded particulate suspensions" 28 : 815-, 2003

      3 S. Jung, "Ink-jet-printed organic-inorganic hybrid dielectrics for organic thin-film transistors" 112 : 5245-, 2008

      4 J. Moon, "Ink-jet printing of binders for ceramic components" 85 : 755-, 2002

      5 F. Girard, "Evaporation and marangoni driven convection in small heated water droplets" 22 : 11085-, 2006

      1 J. Gurauskis, "Tape casting of Y-TZP with low binder content" 33 : 1099-, 2007

      2 B. Derby, "Inkjet printing of highly loaded particulate suspensions" 28 : 815-, 2003

      3 S. Jung, "Ink-jet-printed organic-inorganic hybrid dielectrics for organic thin-film transistors" 112 : 5245-, 2008

      4 J. Moon, "Ink-jet printing of binders for ceramic components" 85 : 755-, 2002

      5 F. Girard, "Evaporation and marangoni driven convection in small heated water droplets" 22 : 11085-, 2006

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      유사연구자 (20) 활용도상위20명

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2026 평가예정 재인증평가 신청대상 (재인증)
      2020-01-01 평가 등재학술지 유지 (재인증) KCI등재
      2017-01-01 평가 등재학술지 유지 (계속평가) KCI등재
      2013-01-01 평가 등재 1차 FAIL (등재유지) KCI등재
      2010-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2008-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2006-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2005-05-30 학회명변경 영문명 : 미등록 -> The Korean Institute of Electrical and Electronic Material Engineers KCI등재
      2004-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2001-01-01 평가 등재학술지 선정 (등재후보2차) KCI등재
      1998-07-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
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      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 0.13 0.13 0.13
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.14 0.14 0.247 0.06
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