Wafer polishing makes the surface planarization to achieve a high-quality. The pressure distribution is an important parameter of polishing process. This study shows the pressure distribution between the polishing pad and the wafer attached by machine...
Wafer polishing makes the surface planarization to achieve a high-quality. The pressure distribution is an important parameter of polishing process. This study shows the pressure distribution between the polishing pad and the wafer attached by machine's head. The experiments were performed to observe the morphology of pressure, when the machine's head was pressed down onto the polishing pad.
It is found that the pressure distribution is depended on the damping materials in the preliminary experiment. To measure the pressure distribution, the pressure measuring film is used. The simulation result of head is compared with the measured pressure distribution. As the static pressures are compared, it will be shown the status of pressure by the damping materials of machine's head. On polishing experiment, vibration and frequency were measured and analyzed.