Characterization of the adhesive for low-temperature curing property using the synthesized polymers = Characterization of the adhesive for low-temperature curing property using the synthesized polymers

다국어 초록 (Multilingual Abstract)

Light emitting diodes (LEDs) have increasingly been studied for application in the field of displays and lighting to fabricate environmentally friendly illumination devices with low energy consumption. The LED adhesive is essential to stick the light diffusion lens on the substrate for smooth and bright light of the LED. In order to increase the productivity of the LED lens, it is required to the LED lens adhesives rapidly cured at a low temperature. The LED lens adhesives are composed of epoxy resins, hardener and catalyst. At low temperatures, the curing reaction of epoxy and mercaptan is faster than the reaction of epoxy and amine. In this study, we are studied the adhesive behaviors of diglycidyl ether of bisphenol A (DGEBA) and synthesized thiol-polymer by different methods. We adopted the thiol-polymer with different method in order to enable low-temperature and fast curing.