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https://www.riss.kr/link?id=O36931581
1999년
eng
학술저널
EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE
356-362 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0953585808
European microelectronics and packaging conference
12th
1999 Jun
Harrogate
0
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다운로드
New Configuration of LTCC Passive Components
Behaviour and Performances of Buried Resistors in Green Tape
Cost Trade-offs of Constrained Sintering of Low Temperature Cofired Ceramic
A Low Loss LTCC Technology, Combined with Photo-patterning Processes for Microwave Applications