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https://www.riss.kr/link?id=O37879042
Wang, R. C. J. ; Shih, J. R. ; Chu, L. H. ; Doong, K. Y. Y. ; Wang, L. S. ; Wei, P. C. ; Su, D. S. ; Yang, C. T. ; Chiu, C. C. ; Su, D.
2002년
eng
학술저널
PROCEEDINGS OF THE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS
23-26 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0780374169
Physical & failure analysis of integrated circuits
International symposium; 9th
Singapore
2002; Jul
0
상세조회0
다운로드
INVITED PAPER: Failure Analysis Tailored to Demand - A Business Model for High Tech Service
ISTFA 2001 BEST PAPER: Resistive Interconnection Localization
A New Observation in Hot-Carrier Induced Drain Current Degradation in Deep-Sub-Micrometer nMOSFETs