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https://www.riss.kr/link?id=O43883694
2005년
eng
0272-9172
학술저널
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
69-74 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0
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Effect of Corrosion Inhibitor (BTA) in Citric Acid Based Slurry on Cu CMP
Effect of Temperature on Defect Generation During Copper Chemical Mechanical Planarization
Potential-pH Diagrams of Interest to Chemical Mechanical Planarization of Copper Thin Films
Investigation on Abrasive Free Copper Chemical Mechanical Planarization for Cu/Low-k and Cu