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https://www.riss.kr/link?id=O106255948
2015년
eng
학술저널
IPACK
V003T04A001-V00 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems
San Francisco, CA
Jul 2015
0
상세조회0
다운로드
Heat Transfer Characteristics of Self-Rewetting Fluid and its Application in Heat Pipe
System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles
Users' Thermal Response to a Simulated Tablet Computer Surface
MD Evaluation of the IR Spectra of DNA Bases in the Process of Transport Through Graphene Nanopore