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https://www.riss.kr/link?id=O41824129
2003년
eng
학술저널
ASME -PUBLICATIONS- EPP
559-564 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0791837149
International mechanical engineering congress and exposition; Electronic and Photonic Packaging Division; Electronic and photonic packaging electrical systems and photonic design and nanotechnology
Technical sessions
Washington, D.C
2003; Nov
0
상세조회0
다운로드
Design and Fabrication of High Frequency Coaxial Transmission Line
Contact Reliability of Innovative Compliant Interconnects for Next Generation Electronic Packaging
Characterization of Anisotropic Conductive Adhesives