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https://www.riss.kr/link?id=O60871830
2012년
eng
학술저널
SMTA INTERNATIONAL CONFERENCE
223-230 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
9781622768967
Surface Mount Technology Association
International Conference
Orlando, FL
2012; Oct
0
상세조회0
다운로드
Board Level Reliability Cyclic Bend Test Study on WCSP Packages
Drop Reliability Test on Different Dimensional Lead-Free Wafer Level Chip Scale Packages
Mechanical Reliability: Updated Results from a Spherical Bend Test Program
On the Fatigue Life of Microelectronic Interconnects in Cycling With Varying Amplitudes