Recently, as electronic devices and main boards have been miniaturized and increased in performance, the power density of emission has been rapidly increasing. In order to improve the heat dissipation performance of the electronic device, a heat condu...
Recently, as electronic devices and main boards have been miniaturized and increased in performance, the power density of emission has been rapidly increasing. In order to improve the heat dissipation performance of the electronic device, a heat conductive material having excellent internal heat dissipation performance is used. Accordingly, in this study, nickel nano thermal grease was prepared by mixing nickel nano powder used as a heat transfer medium with silicon oil. As a result, it improved by about 190% compared to silicone base oil.