휴대용 컴퓨터내의 이상유동 냉각시스템을 이용한 모사칩의 열성능에 관한 연구 = A Study on Thermal Performance of Simulated Chip using a Two Phase Cooling System in a Laptop Computer

다국어 초록 (Multilingual Abstract)

??In this study, a two-phase closed loop cooling system is designed and tested for a laptop computer using a FC-72. The cooling system is characterized by a parametric study which determines the effects of existence of a boiling enhancement microstructure, initial system pressure, volume fill ratio of coolant and inclination angle of condenser on the thermal performance of the closed loop. Experimental data show the optium condition when the volume ratio of working fluid is 70%, the pump flowing is 6ml/min, and the inclination angle of condenser is 0°. This research shows the maximum values which can dissipate 33W of chip power with a chip temperature maintained at 95℃.

목차 (Table of Contents)

• ABSTRACT
• 1. 서론
• 2. 실험장치 및 방법
• 3. 실험결과 및 고찰
• 4. 결론
• 후기
• 참고문헌

참고문헌 (Reference)

1 Condo, Y., "Technology in Electronic Equipment" 2003

2 Mochizuki, M., "Hinged Heat Pipes for Cooling Notebook PCs" 64-72, 1997

3 Pal, A., "Design and Performance Evaluation of a Compact Thermosyphon"

4 박상희, "Cold plate를 이용한 휴대용 컴퓨터 냉각 시스템의 열성능에 관한 연구" 한국기계가공학회 8 (8): 83-89, 2009

5 Jiang, L., "Closed-Loop Electroosmotic Microchannel Cooling System for VLSI Circuits"

6 Camil-Daniel Ghiu, "Boiling Performance of Single-Layered Enhanced Structures" 127 : 675-683, 2005