1 V. Misra,, "Use of metal-oxide-semiconductor capacitors to detect interactions of Hf and Zr gate electrodes with SiO2 and ZrO2" 78 (78): 4166-, 2001.
2 R. Beyers, "Thermodynamic considerations in re fractory metal-silicon- oxygen systems" no. 1 : 147-, 1984.
3 I. Brain, "Thermochemical data of pure substan ces" 1440-, 1994.
4 J. E. Suarez, "Thermal stability of polysilicon resistors" IEEE 537-, 1991.
5 and Y. C. Lu, "Thermal properties of ruthenium dioxide films" 205 : 266-, 1991.
6 H. Zhong, "Properties of Ru-Ta allo ys as gate electrodes for NMOS and PMOS silic on devices" 467-, 2001.
7 H. Iwai, "Problems and solutions for downsizing CMOS below 0.1㎛" 1-, 2000.
8 Q. Lu, "Metal gate work function adjustment for future CMOS technology" 45-, 2001.
9 M. A. Pawlak, "Investigation of Iridium as a gate el ect rode for deep sub-micron CMOS technology" published by Elsevier B.V 2003
10 D. R. Gaskell, "Introduction to metallurgical ther modynamics" 226-, 1998.
1 V. Misra,, "Use of metal-oxide-semiconductor capacitors to detect interactions of Hf and Zr gate electrodes with SiO2 and ZrO2" 78 (78): 4166-, 2001.
2 R. Beyers, "Thermodynamic considerations in re fractory metal-silicon- oxygen systems" no. 1 : 147-, 1984.
3 I. Brain, "Thermochemical data of pure substan ces" 1440-, 1994.
4 J. E. Suarez, "Thermal stability of polysilicon resistors" IEEE 537-, 1991.
5 and Y. C. Lu, "Thermal properties of ruthenium dioxide films" 205 : 266-, 1991.
6 H. Zhong, "Properties of Ru-Ta allo ys as gate electrodes for NMOS and PMOS silic on devices" 467-, 2001.
7 H. Iwai, "Problems and solutions for downsizing CMOS below 0.1㎛" 1-, 2000.
8 Q. Lu, "Metal gate work function adjustment for future CMOS technology" 45-, 2001.
9 M. A. Pawlak, "Investigation of Iridium as a gate el ect rode for deep sub-micron CMOS technology" published by Elsevier B.V 2003
10 D. R. Gaskell, "Introduction to metallurgical ther modynamics" 226-, 1998.
11 Y. S. Suh, "Electrical characteristics of TaSixNy gate electrodes" 47-, 2001.
12 Q. Lu, "Dual-metal gate technology for deep-submicron CMOS transistors" 72-, 2000.
13 C. H. Choi,, "Dopant profile and gate geometric effects on polysilicon gate depletion in scaled MOS" 49 (49): 1227-, 2002.
14 T. Ushiki, "Chemical reaction concerns of gate metal with gate dielectric in Ta gate MOS device: An ef fect of self-sealing barrier configuration inter posed between Ta and SiO2" 47 (47): 2201-, 2000.
15 H. Zhong, "Charac terization of RuO2 electrode on Zr silicate and ZrO2 dielectrics" 78 (78): 1134-, 2001.
16 R. Lin, "An adjustable work function technology using Mo gate for CMOS devies" 23 (23): 49-, 2002.