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KISSIn this study, the metal composite with a carbon nanotube sheet laminated on aluminum was manufactured using Spark Plasma Sintering (SPS), and the thermal conductivity and interface microstructure according to the direction were analyzed. Wettability ...
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RISS 인기검색어
탄소나노튜브 시트를 이용한 알루미늄 복합재의 계면제어 및 열전도도 특성에 관한 연구 = Study on the Interface and Thermal Conductivity of Aluminum Composites Reinforced Carbon Nanotube Sheets
한글로보기https://www.riss.kr/link?id=A109721888
- 저자
- 발행기관
- 학술지명
- 권호사항
-
발행연도
2025
-
작성언어
-
- 주제어
-
KDC
500
-
등재정보
KCI등재,ESCI
-
자료형태
학술저널
- 발행기관 URL
-
수록면
74-79(6쪽)
- DOI식별코드
- 제공처
-
0
상세조회 -
0
다운로드
부가정보
다국어 초록 (Multilingual Abstract)
In this study, the metal composite with a carbon nanotube sheet laminated on aluminum was manufactured using Spark Plasma Sintering (SPS), and the thermal conductivity and interface microstructure according to the direction were analyzed. Wettability was improved between aluminum and carbon nanotubes through surface treatment using oxygen plasma treatment, and it was confirmed that an oxygen functional group was formed on the surface of the carbon nanotube sheet. Thermal conductivity of the in-plane and through-plane of the manufactured metal composite was 201.7 W/mK and 149.19 W/mK respectively. The formation of an intermediate layer at the interface was confirmed through electron microscopy, which directly affects interfacial bonding strength and thermal conductivity enhancement.
In this study, the metal composite with a carbon nanotube sheet laminated on aluminum was manufactured using Spark Plasma Sintering (SPS), and the thermal conductivity and interface microstructure according to the direction were analyzed. Wettability was improved between aluminum and carbon nanotubes through surface treatment using oxygen plasma treatment, and it was confirmed that an oxygen functional group was formed on the surface of the carbon nanotube sheet. Thermal conductivity of the in-plane and through-plane of the manufactured metal composite was 201.7 W/mK and 149.19 W/mK respectively. The formation of an intermediate layer at the interface was confirmed through electron microscopy, which directly affects interfacial bonding strength and thermal conductivity enhancement.
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