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https://www.riss.kr/link?id=O56977240
2011년
eng
2156-3950
2156-3985
SCOPUS;SCIE
학술저널
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
964-974 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0
상세조회0
다운로드
Effects of Acid Electrolytes and Electropolishing Conditions on Laser-Stencil Printing Performance
Interface Formation Between Metal and Polyimide in High Wiring Density Build-up Substrate
New Silver Paste for Die-Attaching Ceramic Light-Emitting Diode Packages
Development of Large Die Fine-Pitch Cu/low-k FCBGA Package with through Silicon via (TSV) Interposer