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https://www.riss.kr/link?id=O42426998
2004년
eng
학술저널
PROCEEDINGS OF THE IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE
51-53 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0780383087 (pbk.)
International interconnect technology
7th:; CONFERENCE
San Francisco, CA
2004; Jun
0
상세조회0
다운로드
Invited - Copper Metallization for Advanced Interconnects: The Electrochemical Revolution
Characteristics of PAALD-TaN Thin Films Derived from TAIMATA Precursor for Copper Metallization
Comprehensive Electromigration Studies on Dual-Damascene Cu Interconnects with ALD WCxNy Barriers