1 좌성훈, "웨이퍼 레벨 진공 패키징된 MEMS 자이로스코프 센서의 파괴 인자에 관한 연구" 한국마이크로전자및패키징학회 10 (10): 7-65, 2003
2 M. Shanmugavalli, "Uncertainty analysis of micro differential pressure sensor using interval analysis" 2 (2): 463-, 2009
3 S. D. Nguyen, "MEMS capacitive flow sensor for natural gas pipelines" 231 : 28-, 2015
4 E. S. Hwang, "Flexible Module Packaging using MEMS technology" 74 : 2002
5 M. H. Lee, "Detailed characterization of anodic bonding process between glass and thin-film coated silicon substrates" 86 (86): 103-, 2000
6 R. Sood, "Design and development of automatic water flow meter" 3 (3): 49-, 2013
7 P. Eswaran, "Design Analysis of MEMS Capacitive Differential pressure sensor for Aircraft Altimeter" 2 (2): 14-, 2012
8 S. T. Moe, "Capacitive differential pressure sensor for harsh environments" 83 : 30-, 2000
9 L. Chen, "A silicon carbide capacitive pressure sensor for in-cylinder pressure measurement" 2-8 : 145-, 2008
1 좌성훈, "웨이퍼 레벨 진공 패키징된 MEMS 자이로스코프 센서의 파괴 인자에 관한 연구" 한국마이크로전자및패키징학회 10 (10): 7-65, 2003
2 M. Shanmugavalli, "Uncertainty analysis of micro differential pressure sensor using interval analysis" 2 (2): 463-, 2009
3 S. D. Nguyen, "MEMS capacitive flow sensor for natural gas pipelines" 231 : 28-, 2015
4 E. S. Hwang, "Flexible Module Packaging using MEMS technology" 74 : 2002
5 M. H. Lee, "Detailed characterization of anodic bonding process between glass and thin-film coated silicon substrates" 86 (86): 103-, 2000
6 R. Sood, "Design and development of automatic water flow meter" 3 (3): 49-, 2013
7 P. Eswaran, "Design Analysis of MEMS Capacitive Differential pressure sensor for Aircraft Altimeter" 2 (2): 14-, 2012
8 S. T. Moe, "Capacitive differential pressure sensor for harsh environments" 83 : 30-, 2000
9 L. Chen, "A silicon carbide capacitive pressure sensor for in-cylinder pressure measurement" 2-8 : 145-, 2008