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      SCIE SCOPUS KCI등재

      Annealing Effects on Charge Trap Flash with TAHOS Structure

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      https://www.riss.kr/link?id=A109228762

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      다국어 초록 (Multilingual Abstract)

      Flash memory is gaining attention due to its scalability, high reliability, and multilevel capabilities. This study investigated the charge trapping characteristics of high permittivity HfO₂ films with Al₂O₃ as a blocking oxide. TAHOS (TiN-Al₂O₃-HfO₂-SiO₂-Si) structure capacitors were fabricated to explore the annealing effects for charge trap flash (CTF) memory device applications. HfO₂, serving as a charge trapping layer, offers the advantage of achieving a wide memory window owing to its high trap density. In this work, various characteristics related to memory cells were examined based on annealing temperature and gas type. Post-deposition annealing (PDA) was conducted from 900 °C to 1050 °C and forming gas annealing (FGA) was performed at 450 °C for 10 minutes using H₂ gas. We analyzed the memory window and flat-band voltage distributions by measuring C-V characteristics. These results suggest that optimal annealing conditions can be helpful to improve memory characteristics in TAHOS stacked flash memories.
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      Flash memory is gaining attention due to its scalability, high reliability, and multilevel capabilities. This study investigated the charge trapping characteristics of high permittivity HfO₂ films with Al₂O₃ as a blocking oxide. TAHOS (TiN-Al₂...

      Flash memory is gaining attention due to its scalability, high reliability, and multilevel capabilities. This study investigated the charge trapping characteristics of high permittivity HfO₂ films with Al₂O₃ as a blocking oxide. TAHOS (TiN-Al₂O₃-HfO₂-SiO₂-Si) structure capacitors were fabricated to explore the annealing effects for charge trap flash (CTF) memory device applications. HfO₂, serving as a charge trapping layer, offers the advantage of achieving a wide memory window owing to its high trap density. In this work, various characteristics related to memory cells were examined based on annealing temperature and gas type. Post-deposition annealing (PDA) was conducted from 900 °C to 1050 °C and forming gas annealing (FGA) was performed at 450 °C for 10 minutes using H₂ gas. We analyzed the memory window and flat-band voltage distributions by measuring C-V characteristics. These results suggest that optimal annealing conditions can be helpful to improve memory characteristics in TAHOS stacked flash memories.

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      목차 (Table of Contents)

      • Abstract
      • I. INTRODUCTION
      • II. DEVICE CHARACTERISTICS
      • III. POST DEPOSITION ANNEALING (PDA)
      • IV. FORMING GAS ANNEALING (FGA)
      • Abstract
      • I. INTRODUCTION
      • II. DEVICE CHARACTERISTICS
      • III. POST DEPOSITION ANNEALING (PDA)
      • IV. FORMING GAS ANNEALING (FGA)
      • V. CONCLUSIONS
      • REFERENCES
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