Fabrication of micro-conductive patterns on glass surfaces using a laser direct writing method

다국어 초록 (Multilingual Abstract)

A micro-conductive pattern was fabricated on an insulating substrate (SiO2) surface using a direct laser writing method known
as laser-induced forward transfer (LIFT). The LIFT process, employing a multi-scan mode laser, fabricated the microconductive
pattern using an electroless nickel plating procedure as a method for improving the deposition process of the seed
pattern on the insulating substrate surface and the electrical conductivity of the pattern. In the multi-scan mode LIFT process,
when the laser beam irradiates a thin metal film, the photon energy is absorbed by the film and converted into thermal energy,
and the thermal decomposition reaction produced by the resulting heat conduction forms a deposit on the substrate. This
paper analyzes the impact of seed pattern formation by LIFT, and the impact of key variables in the electroless nickel plating
process, on the micro-conductive pattern fabrication, using scanning electron microscopy (SEM) and an optical microscope.
It also examines the impact of the process variables on the cross-sectional shape and surface quality of the deposited pattern.

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