1 N. Eustathopoulos, "Wettability at High Temperatures,”Pergamon Materials Series" Elsevier 1999
2 M. Mouas, "Staticstructure and dynamic properties in liquid Sn96.2, Ag3.8 lead free solder: Structure factor, diffusion coefficients and viscosity" Elsevier 2003
3 P. E. Tegehall, "Review of the Impact of Intermetallic Layers on the Brittleness of Tin Lead and Lead-Free Solder Joints" IVF Industrial Research and Development Corporation 2006
4 M. Berthou, "Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage" 2013
5 R. N. Raoelison, "Magnetic pulse welding: Interface of Al/Cu joint and Investigation of intermetallic formation effect on the weld features" Laboratory Roberval 2014
6 A. Grusd, "Lead-Free Solders in Electronics" Heraeus Inc,West Conshohocken
7 C. M. Carabello, "Lead-Free Solder New Methodolgy and Perception"
8 N. Mookam, "Institute of Technology" Ladkrabang 2011
9 Y. M. Jen, "Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages"
10 eHow Contributor, "Facts about Soldering"
1 N. Eustathopoulos, "Wettability at High Temperatures,”Pergamon Materials Series" Elsevier 1999
2 M. Mouas, "Staticstructure and dynamic properties in liquid Sn96.2, Ag3.8 lead free solder: Structure factor, diffusion coefficients and viscosity" Elsevier 2003
3 P. E. Tegehall, "Review of the Impact of Intermetallic Layers on the Brittleness of Tin Lead and Lead-Free Solder Joints" IVF Industrial Research and Development Corporation 2006
4 M. Berthou, "Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage" 2013
5 R. N. Raoelison, "Magnetic pulse welding: Interface of Al/Cu joint and Investigation of intermetallic formation effect on the weld features" Laboratory Roberval 2014
6 A. Grusd, "Lead-Free Solders in Electronics" Heraeus Inc,West Conshohocken
7 C. M. Carabello, "Lead-Free Solder New Methodolgy and Perception"
8 N. Mookam, "Institute of Technology" Ladkrabang 2011
9 Y. M. Jen, "Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages"
10 eHow Contributor, "Facts about Soldering"
11 J. Sylvester, "Eutectic Solder Die Attach for High-Powered Devices" Palomar Technologies 2011
12 J.O.G.Parent, "Effects of Intermetallic formation at the interface between Copper and Lead-tin Solder" Carnegie Mellon University
13 T. C. Chiu, "Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages" 2004
14 S. Montgomery, "Definition of Soldering"
15 N.A, "Definition of Intermetallic"
16 Y. Y. Uan, "Contact Angle and Wetting Properties"
17 K. Brindley, "Chapter 12-Soldering" 205-206, 2011
18 J. Fan, "Bremer Institut für angewandte Strahltechnik Gmbh" 2011