High pressure deuterium (HPD) annealing is an advancing technology for the fabrication of modern semiconductor devices. In this work, gate-enclosed FETs are fabricated on a silicon substrate as test vehicles. After a cycle for the HPD annealing, the d...
High pressure deuterium (HPD) annealing is an advancing technology for the fabrication of modern semiconductor devices. In this work, gate-enclosed FETs are fabricated on a silicon substrate as test vehicles. After a cycle for the HPD annealing, the device parameters such as threshold voltage (V<sub>TH</sub>), subthreshold swing (SS), on-state current (I<sub>ON</sub>), off-state current (I<sub>OFF</sub>), and gate leakage (I<sub>G</sub>) were measured and compared depending on the HPD. The HPD annealing can passivate the dangling bonds at Si-SiO<sub>2</sub> interfaces as well as eliminate the bulk trap in SiO<sub>2</sub>. It can be concluded that adding the HPD annealing as a fabrication process is very effective in improving device reliability, performance, and variability.