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https://www.riss.kr/link?id=O61762631
2012년
eng
1938-5862
1938-6737
학술저널
ECS TRANSACTIONS
227-240 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
9781623320065 (Hardcover)
Semiconductor wafer bonding: science, technology and applications
International symposium; 12th
Honolulu, HI
2012
0
상세조회0
다운로드
(Invited) Direct Bonding Energy in Anhydrous Atmosphere
Study of Hydrophilic Si Direct Bonding with Ultraviolet Ozone Activation for 3D Integration
Hydrophilic Wafer Bonding - An Acid/Base Concept
Surface Activation for Semiconductor Wafer Direct Bonding Using Polymer-Stripping Wet Chemicals