Sn-3.0Ag-0.5Cu 솔더 접합부의 계면반응과 취성파괴율에 미치는 Thin ENEPIG 도금두께의 영향

다국어 초록 (Multilingual Abstract)

In this paper, we evaluated the interfacial reactions and brittle fracture behaviors of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layers with different Ni and Pd thicknesses for fine-pitch package applications. Firstly, the interfacial reactions and mechanical reliability of Sn-3.0Ag-0.5Cu (SAC305)/thin ENEPIG solder joints were evaluated. (Cu,Ni)6Sn5 intermetallic compound (IMC) was formed at all of the thin ENEPIG interfaces, and P-rich Ni layer was also observed at the joint interface of the Pd substrate with 0.3 ㎛ Ni thickness. The interfacial IMC thickness decreased with increasing Ni and Pd thicknesses. In addition, the IMC thickness was affected by the contents of the Pd plating layer. The IMC thickness for the Pd-P substrate was thicker than that for the Pd substrate. In the high-speed shear test, the brittle fracture rate decreased with increasing Ni and Pd thickness. Also, the brittle fracture rate was affected by the components of the Pd plating layer, and the brittle fracture rate for the Pd substrate was lower than that for the Pd-P substrate. The ENEPIG joint with thicker Ni plating layer had superior interfacial stability and mechanical reliability.

목차 (Table of Contents)

• Abstract
• 1. 서론
• 2. 실험방법
• 3. 실험결과
• 4. 결론
• References

참고문헌 (Reference)

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