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2 이재언 ; 김근수 ; 허석환, "내산화성 개선 Sn-Zn계 저온용 무연솔더 개발" 대한용접접합학회 29 (29): 514-521, 2011
3 L. Pu, "Undercooling and microstructure analysis for the design of low melting point solder" IEEE Electronic Devices Society (EDS) 1-, 2021
4 H. W. Miao, "Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints" 11 (11): 609-618, 2000
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6 김병우 ; 최혁기 ; 전혜원 ; 이도영 ; 손윤철, "Ru Nanoparticle이 첨가된 Sn-58Bi 솔더의 기계적 신뢰성 및 계면반응에 관한 연구" 한국마이크로전자및패키징학회 28 (28): 95-103, 2021
7 F. Wang, "Recent progress on the development of Sn-Bi based low-temperature Pb-free solders" 30 (30): 3222-3243, 2019
8 W. R. Osório, "Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys" 572 : 97-106, 2013
9 M. Li, "Microstructure and mechanical properties of Sn-58Bi eutectic alloy with Cu/P addition" 7 (7): 116502-, 2020
10 C. J. Lee, "Mechanical properties of Sn-58wt% Bi solder containing Ag-decorated MWCNT with thermal aging tests" 820 : 153077-, 2020
1 강혜준 ; 백범규 ; 정재필, "최근 SnBi계 저온 솔더 합금 및 접합 특성" 대한용접접합학회 38 (38): 576-583, 2020
2 이재언 ; 김근수 ; 허석환, "내산화성 개선 Sn-Zn계 저온용 무연솔더 개발" 대한용접접합학회 29 (29): 514-521, 2011
3 L. Pu, "Undercooling and microstructure analysis for the design of low melting point solder" IEEE Electronic Devices Society (EDS) 1-, 2021
4 H. W. Miao, "Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints" 11 (11): 609-618, 2000
5 M. Mccormack, "Significantly Improved Mechanical Properties of Bi- Sn Solder Alloys by Ag- Doping" Springer Science and Business Media LLC 26 (26): 954-958, 1997
6 김병우 ; 최혁기 ; 전혜원 ; 이도영 ; 손윤철, "Ru Nanoparticle이 첨가된 Sn-58Bi 솔더의 기계적 신뢰성 및 계면반응에 관한 연구" 한국마이크로전자및패키징학회 28 (28): 95-103, 2021
7 F. Wang, "Recent progress on the development of Sn-Bi based low-temperature Pb-free solders" 30 (30): 3222-3243, 2019
8 W. R. Osório, "Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys" 572 : 97-106, 2013
9 M. Li, "Microstructure and mechanical properties of Sn-58Bi eutectic alloy with Cu/P addition" 7 (7): 116502-, 2020
10 C. J. Lee, "Mechanical properties of Sn-58wt% Bi solder containing Ag-decorated MWCNT with thermal aging tests" 820 : 153077-, 2020
11 Jae-Hyeong Park, "Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers" Institute of Electrical and Electronics Engineers (IEEE) 9 (9): 2152-2159, 2019
12 N. Jiang, "Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder" 30 (30): 17583-17590, 2019
13 Z. Wang, "Influences of Ag and In alloying on Sn- Bi eutectic solder and SnBi/Cu solder joints" 30 (30): 18524-18538, 2019
14 A. T. Tan, "Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions" 2015
15 L. Yang, "Influence of BaTiO3 nanoparticle addition on microstructure and mechanical properties of Sn-58Bi solder" 44 (44): 2473-2478, 2015
16 F. Wang, "Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier" 28 (28): 19051-19060, 2017
17 H. E. Peng, "Improvement of mechanical properties of Sn-58Bi alloy with multi-walled carbon nanotubes" 22 : 692-696, 2012
18 L. Yang, "Improved microstructure and mechanical properties for Sn58Bi solder alloy by addition of Ni-coated carbon nanotubes" 642 : 7-15, 2015
19 R. S. Sidhu, "Impact of processing conditions and solder mate rials on surface mount assembly defects" 63 (63): 47-51, 2011
20 D. Xie, "Head in pillow (HIP) and yield study on SIP and PoP assembly" IEEE Components, Packaging and Manufacturing Technology Society (CPMT) 752-, 2009
21 N. Hansen, "Hall-Petch relation and boundary strengthening" 51 (51): 801-806, 2004
22 Z. Zhu, "Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC)stressing" 91 : 179-182, 2018
23 S. Amares, "Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2) Nanoparticles" 66 : 407-418, 2021
24 T. Nishizawa, "Examination of the Znenr relationship between grain size and particle dispersion" 38 (38): 950-956, 1997
25 L. T. Chen, "Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization" 21 (21): 962-969, 2006
26 S. Liu, "Electromigration behavior of Cu/Sn-58Bi-1Ag/Cu solder Joints by ultrasonic soldering process" 31 (31): 11997-12003, 2020
27 L. Shen, "Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation" 558 : 253-258, 2012
28 W. Dong, "Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-based solder alloy" 37 (37): 982-991, 2008
29 Z. Zhao, "Effects of package warpage on head-in-pillow defect" 56 (56): 1037-1042, 2015
30 X. Li, "Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys" 684 : 328-334, 2017
31 Y. Wei, "Effects of endogenous Al and Zn phases on mechanical properties of Sn58Bi eutectic alloy" 175 : 111089-, 2021
32 S. Zhou, "Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy" 744 : 560-569, 2019
33 L. Yang, "Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging" 667 : 368-375, 2016
34 O. Mokhtari, "Effects of In and Ni addition on microstructure of Sn-58Bi solder joint" 43 (43): 4158-4170, 2014
35 W. Zhu, "Effects of Al2O3nanoparticles on the microstructure and properties of Sn58Bi solder alloys" 29 (29): 7575-7585, 2018
36 S. Liu, "Effects of Ag on the microstructure and shear strength of rapidly solidified Sn-58Bi solder" 30 (30): 6701-6707, 2019
37 R. M. Shalaby, "Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys" 560 : 86-95, 2013
38 Y. Li, "Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58BiAg composite solders" 645 : 566-576, 2015
39 L. Yang, "Effect of nanosized graphite on properties of Sn-Bi solder" 24 (24): 4180-4185, 2013
40 D. P. Jiang, "Effect of minor Ag and Cu additions on melting characteristics, wettability and microstructures of Sn58Bi solder" IEEE Components, Packaging and Manufacturing Technology Society (CPMT) 1098-, 2017
41 Q. S. Zhu, "Effect of Zn addition on microstructure of Sn-Bi joint" IEEE Components, Packaging and Manufacturing Technology Society (CPMT) 1043-, 2009
42 X. Liu, "Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder" 21 (21): 1046-1054, 2010
43 C. Zhang, "Effect of Sb content on properties of Sn-Bi solders" 24 (24): 184-191, 2014
44 K. N. Tu, "Effect of Joule heating and cur rent crowding on electromigration in mobile technology" 4 (4): 011101-, 2017
45 A. Singh, "Effect Of 3% Molyb denum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As-Reflowed Low Mass Sn-58Bi (SB) Solder Alloy" 77 (77): 69-87, 2021
46 R. Raj, "Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys" 110 (110): 1150-1159, 2019
47 D. Grivas, "Deformation of Pb Sn eutectic alloys at relatively high strain rates" 27 (27): 731-737, 1979
48 Z. Mei, "Characterization of eutectic Sn Bi solder joints" 21 (21): 599-607, 1992
49 Y. Maruya, "Bonding characteristics of Sn-57Bi-1Ag low temperature lead-free solder to gold-plated copper" 184 : 223-230, 2017
50 S. Tikale, "Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate" 32 (32): 2865-2886, 2021
51 K. Suganuma, "Advances in lead-free electronics soldering" 5 (5): 55-64, 2001
52 H. Ma, "A review of mechanical properties of lead-free solders for electronic packaging" 44 (44): 1141-1158, 2009
53 S. Cheng, "A review of lead free solders for electronics applications" 75 : 77-95, 2017