Development of New Ethcing Gas for Cu Dry Etching and Dry Etching Process with Small Chelators = Development of New Ethcing Gas for Cu Dry Etching and Dry Etching Process with Small Chelators

다국어 초록 (Multilingual Abstract)

An etching process is one of the important processing in semiconductor manufacturing. Dry etching is a process of making a circuit on a substrate with gases molecules in high-density plasma conditions. Br₂ and Cl₂ are the most common gases in modern copper dry etching procedure for elimination of substrate materials at high temperature.
Although Br₂ and Cl₂ are regarded as useful gases for making a complex with a copper, copper complex remains on the substrate due to low volatility and it makes difficult to form exquisite patterning. To overcome these problems, development of volatile gases is required even after making a complex with copper under low temperature in a dry etching process. Here we introduced many potential volatile gases for a dry etching process. These gases have a high affinity with copper and have a low molecular weight so that evaporate under relatively low temperature.