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웨이퍼 폴리싱 공정의 회전속도와 진폭속도에 따른 가공특성 연구
이은상(Eun-Sang Lee),이상균(Sang-Gyun Lee),김성현(Sung-Hyun Kim),원종구(Jong-Koo Won) 한국기계가공학회 2012 한국기계가공학회지 Vol.11 No.1
The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.
최적조건 선정을 위한 Pad 특성과 Wafer Final Polishing의 가공표면에 관한 연구
원종구(Jong-Koo Won),이은상(Eun-Sang Lee),이상균(Sang-Gyun Lee) 한국기계가공학회 2012 한국기계가공학회지 Vol.11 No.1
Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.
자기연마법에 의한 파인 세라믹 BAR의 가공특성에 관한 연구
문상돈 ( Sang-don Mun ),( Takeo Shinmura ),( Hitomi Yamaguchi ),( Toshio Aizawa ),조철용 ( Chul-yong Cho ) 한국환경기술학회 2006 한국환경기술학회지 Vol.7 No.3
본 논문에서는 파인 세라믹 바를 고속으로 회전시켜 자기연마법을 이용하여 고정밀가공의 가능성을 확인하였다. 또한 표면 정밀도를 향상시키기 위해 전해철분과 초정밀 가공용 다이아몬드 입자를 혼합한 지립과 자극의 진동을 이용하였다. 결과적으로 다이아몬드의 입자 크기, 양의 변화 그리고 자극의 진동과 세라믹 바의 표면거칠기가 밀접하게 관련되어 있다는 것을 알 수 있었다. In this paper, the possibility of high precision machining was confirmed by using magnetic abrasive machining with rotating fine ceramic bar in high speed. Also, in order to improve the surface roughness, it was used the vibration of the magnetic pole and the mixed grain which is mixed with diamond paste for ultra precision machining and electrolytic iron powder. As a result, we knew that there is closely connected with diamond grain size, change of quantity and vibration of the magnetic pole to surface roughness of ceramic bar.
연속 전해드레싱을 적용한 세라믹재의 초정밀 래핑에 관한 연구
이은상,송지복,최재영 韓國工作機械學會 2000 한국생산제조학회지 Vol.9 No.5
Application of ceramics has grown considerably due to significant improvement in their mechanical properties such as light weight, chemical stability and superior wear resistance. Despite these character, the use of ceramics has not increased because of poor machinability. The method of using of super-abrasives metal bond wheel was proposed. But it is difficult that super-abrasives metal bond wheel can be dressed. Recently, the technology of in-process electrolytic dressing is devel-oped to solve this problem. If this method is applied, loading and glazing are disappeared apparently. The aim of this study is to determine the machining characteristics in terms of lapping wheel speed, machining time, pressurized weight to the workpiece and peak current using in-process electrolytic dressing applied to the CIB-diamond lapping wheel to achieve ultra-precision lapping machining technique.
자기연마법에 의한 파인세라믹 Bar의 가공특성에 관한 연구
문상돈(Sang-Don Mun),Takeo Shinmura,Hitomi Yamaguchi,Toshio Aizawa,조철용(Chul-Yong Cho) 한국생산제조학회 2006 한국생산제조시스템학회 학술발표대회 논문집 Vol.2006 No.5
In this paper, the possibility of high precision machining was confirmed by using magnetic abrasive finishing process with rotating fine ceramic bar in high speed. Also, in order to improve the surface roughness, it was used the vibration of the magnetic pole and the mixed grain which is mixed with diamond paste for ultra precision processing and electrolytic iron powder. As a result, we knew that there is closely connected with diamond grain size, change of quantity and vibration of the magnetic pole to surface roughness of ceramic bar.
자기연마법에 의한 파인세라믹 Bar의 가공특성에 관한 연구
문상돈(Sang-Don Mun),Takeo Shinmura,Hitomi Yamaguchi,Toshio Aizawa,조철용(Chul-Yong Cho) 한국생산제조학회 2006 한국공작기계학회 춘계학술대회논문집 Vol.2006 No.-
In this paper, the possibility of high precision machining was confirmed by using magnetic abrasive finishing process with rotating fine ceramic bar in high speed. Also, in order to improve the surface roughness, it was used the vibration of the magnetic pole and the mixed grain which is mixed with diamond paste for ultra precision processing and electrolytic iron powder. As a result, we knew that there is closely connected with diamond grain size, change of quantity and vibration of the magnetic pole to surface roughness of ceramic bar.
김현철(Hyun-Chul Kim) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.5
As the demand for micro patterns increases and large surface area had been the trend of technology development, precision machining technology for micro patterns of large surface area is expected to play increasingly important roles in today's manufacturing technology. Therefore, this study is attempt to develop machining technology for 32 nickel-plated molds using single crystal diamond tools.
김현철(Hyun Chul Kim) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.4
본 연구에서는 정밀한 공구 셋팅을 위한 비전 시스템, 대면적 측정을 위한 기상계측 시스템, 공구경로 생성 및 검증 소프트웨어 등을 포함한 대면적 미세 패턴 가공기술을 개발하였다. 이를 통해 무전해 니켈 도금된 32” (675㎜×450㎜) 면적의 금형에 V 및 피라미드 형상의 미세 패턴 가공을 수행하였다. In this study, we focused on developing machining technologies, which include a machine vision system for precise tool setting, an on-machine measurement (OMM) system for large-area measurement, and software for tool path generation and simulation, for the fabrication of large-surface micropatterns in an electro less nickel-plated workpiece with single-crystal diamond tools and a 32-in, 675㎜ × 450㎜ mold with tens of V-and pyramid-shaped micropatterns.