방열소재로의 응용을 위한 고분자 복합소재 내 이방성 필러 구조 제어 연구동향

민성배 ( Seong-bae Min ),김채빈 ( Chae Bin Kim ) 한국복합재료학회 2022 Composites research Vol.35 No.6

전자 기기의 발달에 따라 발생하는 발열 문제를 해결하기 위해 높은 열전도도를 갖는 방열소재의 개발이 필요하다. 고분자 복합소재는 고분자의 장점과 열전도성 필러의 장점을 동시에 지녀 경량 방열소재로 각광받고 있다. 하지만, 산업적으로 요구되는 열전도도를 달성하기 위해서는 볼륨비로 60 이상의 고함량의 필러 충진이 요구되므로 최근에는 필러의 구조 제어를 통해 비교적 저함량의 필러 충진으로도 열 전달 경로를 최적화할 수 있는 연구들이 진행되고 있다. 본 리뷰에서는 고분자 복합소재 내 열전도성 이방성 필러의 구조를 제어해 비교적 적은 필러 함량으로 고열전도성 방열소재를 제작하는 다양한 전략을 소개하고자 한다. Efficient heat dissipation in current electronics is crucial to ensure the best performance and lifespan of the devices along with the users’ safety. Materials with high thermal conductivity are often used to dissipate the generated heat from the electronics to the surroundings. For this purpose, polymer composites have been attracted much attention as they possess advantages rooted from both polymer matrix and thermally conductive filler. In order to meet the thermal conductivity required by relevant industries, composites with high filler loadings (i.e., >60 vol%) have been fabricated. At such high filler loadings, however, composites lose benefits originated from the polymer matrix. To achieve high thermal conductivity at a relatively low filler loading, therefore, constructing the heat conduction pathway by controlling filler structure within the composites may represent a judicious strategy. To this end, this review introduces several recent approaches to manufacturing heat dissipating materials with high thermal conductivity by manipulating thermally conductive filler structures in polymer composites.

자동차용 Heatsink의 열전도도 향상을 위한 다이캐스팅 알루미늄 합금 및 열처리 최적 조건 개발

김주행(Juhaing Kim),정경(Kyung Jeong),박석현(Seokhyun Park),정윤철(Yooncheol Jung) 한국자동차공학회 2018 한국자동차공학회 부문종합 학술대회 Vol.2018 No.6

As eco-friendly automobiles are expanded, electronic control systems are also required to have high performance. Therefore, ECUs and motors, which are essential for electronic control systems, require higher heat dissipation characteristics than conventional ones. In order to achieve high heat dissipation characteristics, it is necessary to improve the thermal conductivity of Heatsink itself, which is directly contacts the heat source and transfers heat quickly among various components. As the conventional Heatsink materials, aluminum alloys which have excellent thermal conductivity characteristics have been applied. In case of low-solute alloy, the thermal conductivity is the highest. However, in the case of automotive Heatsink, a very complicated shape is required, and in order to realize this, it is necessary to manufacture parts by die casting of a high-solute aluminum alloy. As a result, it has lower thermal conductivity than low solute aluminum alloy. In this study, the optimum alloy composition capable of high pressure casting with 7% Si content and T5 heat treatment were applied to achieve thermal conductivity of 178W/mK. This result is a high thermal conductivity characteristic of low-solute wrought aluminum alloy products, resulting in a 38% improvement over ADC12, a commercial die-cast alloy. At the same time, heatsinks for large-capacity motors(BSG) were developed by securing the same castability as ADC12.

휴대용 SSD 외장 하드드라이브 발열문제 개선을 위한 디자인개발 연구

권민성 한국기초조형학회 2018 기초조형학연구 Vol.19 No.1

With the development of technology, the size of electronic devices is becoming smaller, and the processing speed continuously faster. The improvement of electronic devices has thus brought about the thermal issue which should be resolved from the industrial design process. Concerning the small external hard disk SSD technology, the problem of thermal has become a key process to be solved in product development. The purpose of this study is to develop a design that minimizes the heating problem of external hard drives using M.2 SSD. Simulations are carried out to understand the location of thermal, and the principle of heat dissipation. First, the competitive model among the existing products is selected, the temperature changed, and the difference of the electronic parts inside the product measured through experiments. Second, the simulation is conducted using three heat dissipation methods. Measure the temperature variation of the outer surface of product container and each electronic component. Third, based on the measured values, the most efficient heat dissipation method and materials are selected and utilized as a design elements for M.2 SSD external hard drive. Based on the results obtained through the simulation, it is beneficial to eliminate non-heat dissipating elements. Above all, it has great significance in finding and applying design elements in order to solve problems of product degradation caused by thermal problem and to improve users' product use experience. Based on the results of this study, I will use it to develop next generation portable SSD external hard drive design. 기술의 발전에 따라 전자기기의 크기는 점차 소형화 되고 전자정보의 처리 속도는 지속적으로 향상되고 있다. 이에 따라서 전력을 사용하는 전자기기 성능의 발전은 발열문제라는 숙제를 안겨주었다. 이에 따라 열을 발생하는 전자부품을 담고 있는 제품 용기(product enclosure)를 디자인하는 과정에서 부터 방열기능 적용이 구상되어야 한다. 특히 SSD기술이 적용된 초소형 대용량 플레시 메모리를 사용하는 휴대용 외장 하드드라이브의 경우 발열문제 해결이 제품 개발 시 고려해야 할 핵심과제이다. 본 연구는 M.2 SSD를 사용하는 휴대용 외장 하드드라이브의 발열문제 해결에 적합한 디자인 개발을 목적으로 한다. 이를 위해서 발열의 위치와 방열 원리 파악을 위한 모의 실험을 진행한다. 첫째, 기존 제품들 중 경쟁모델을 선정하여 제품 내부의 전자부품 별 온도변화와 차이를 실험을 통하여 측정한다. 둘째, 선별된 3가지 방열방식으로 모의실험을 진행한다. 각 전자부품들과 제품용기의 외곽면 온도 변화를 측정한다. 셋째, 측정된 값과 사용성을 바탕으로 휴대용 제품의 방열에 적합한 방법과 재료를 선정하여 제품디자인 개발 요소로 활용한다. 본 연구의 실험을 통하여 방열에 적합한 디자인요소를 사전에 선별하고자 한다. 선별된 내용들은 이후에 진행될 제품디자인 개발 과정에 효과적으로 활용될 수 있을 것이다. 무엇보다도 발열문제로 인한 제품의 성능저하 문제해결과 사용자의 제품 사용경험 향상을 위한 제품디자인 개발 과정에 적용할 수 있는 디자인요소 발굴에 큰 의미가 있다. 이번 연구를 통하여 정리된 디자인 방안을 토대로 향후 진행될 차세대 휴대용 SSD 외장 하드드라이브 디자인개발에 활용할 것이다.

태양광발전 전력변환장치용 GaN-FET의 방열효율 향상을 위한 PCB 방열구조 열해석

이천규(Lee Cheonkyu),정효재(Jeong Hyo Jae) 한국태양에너지학회 2022 한국태양에너지학회 논문집 Vol.42 No.6

In 2021, the solar power generation capacity of South Korea was 14.6 GW, accounting for 71% of the total renewable energy generation capacity. The market for photovoltaic power conversion devices with high efficiency and power density is expanding rapidly in the country. Gallium Nitride (GaN), a compound semiconductor with a wide band gap, can be used under high voltage and current compared to silicon materials, resulting in its wide use in photovoltaic power conversion devices. Excellent heat dissipation performance of GaN-based devices should be achieved due to their significantly high power and efficiency. In this study, the heat dissipation characteristics of a PCB with FR4 (Flame Retardant 4) material composed of various heat dissipation structures for the effective heat dissipation of GaN-FETs for power conversion systems applicable to a 3 kW solar power generation system were investigated using thermal analysis. Part of the heat generated from the GaN-FET was directly dissipated on its surfaces to the external air, and the other part was transferred to the PCB through conduction and then discharged to the external air through convection on the surfaces of the PCB package. Via holes were considered to improve the heat transfer rate of the PCB in the thickness direction, and a heat sink was applied to expand the heat transfer area. In this study, the heat dissipation characteristics were investigated based on four types of heat dissipation structures of the PCB using the ANSYS transient thermal analysis program. The effect of via holes exposed to external air were analyzed using two types of heat dissipation structures. In addition, two other types of heat dissipation structures were analyzed to compare the top and top/bottom cooling of the PCB package. It was observed that the efficiencies of heat dissipation of the via holes that were unexposed to external air and in both the top and bottom cooling cases were more advantageous than that of the exposed holes and the top cooling case, respectively.

디스플레이용 LED 패키지의 열전도성 변화에 따른 열특성 분석

정민우(Min Woo Jeong),허재혁(Jaehyeok Heo),강훈(Hoon Kang),서태원(Tae Won Seo),김용찬(Yongchan Kim) 대한기계학회 2011 대한기계학회 춘추학술대회 Vol.2011 No.5

LED는 에너지절약적이며, 친환경적이고, 긴 수명을 갖는 매우 강력한 광원이다. 최근 LED는 여러 산업분야에서 적용되고 있으며, 고집적화 및 고출력화되는 경향에 따라 패키지 방열특성의 중요성이 높아지고 있다. 특히 LED 정션에서 발생하는 열은 LED 칩의 신뢰성과 효율에 중요한 영향을 미치기 때문에, LED 패키지는 열적인 문제를 고려하여 설계하여야 한다. 본 논문에서는 디스플레이용 LED의 열적 특성을 전산해석을 이용하여 분석하였고, 패키지 구성 물질의 열전도도 변화에 따른 열특성 개선효과를 고찰하였다. 해석결과에 따르면 die attachment를 위한 paste 부분이 열전달 경로상에서 가장 취약한 것으로 밝혀졌으며, paste 부분의 열전도도 향상에 따라 LED 패키지의 열적 특성은 4.6℃ (8.8%)정도 향상되었다. LED (Light emitting diode) is a powerful lighting source which has several advantages such as high energy efficiency, long life, and eco-friendliness. Recently, LED has been applied to various industrial fields, and the importance of thermal dissipation is increasing due to high power and integration tendency in a LED package. The thermal characteristic of the LED package should be carefully considered in the design process because the heat generated from junction degrades reliability and efficiency of LED. In this study, the thermal dissipation of a top view type LED package for display was numerically analyzed with a variation of thermal conductivity of package material. Thermal resistance was the highest in the paste used for die attachment, and the chip temperature decreased by maximum 4.6℃ (8.8%) with an increase in thermal conductivity of the paste.

탄소나노그리스의 열전도도 향상에 따른 LED 방열성능평가

김창민(Chang Min Kim),정청우(Chung Woo Jung),강용태(Yong Tae Kang) 대한설비공학회 2013 대한설비공학회 학술발표대회논문집 Vol.2013 No.6

적외선 열화상을 활용한 리튬 이온 ESS의 방열설계 성능평가에 관한 연구

김은지(Eun-Ji Kim),이경일(Gyung-Il Lee),김재열(Jae-Yeol Kim) 한국기계가공학회 2020 한국기계가공학회지 Vol.19 No.5

The global battery market is rapidly growing due to the development of vehicles(EV) and wireless electronic products. In particular logistics robots, which hielp to produce EVs, have attracted much interest in research in Korea Because logistics sites and factories operate continuously for 24 hours, the technology that can dramatically increase the operation time of the logistics equipment is rapidly developing, and various high-level technologies are required for the batteries used in. for example, logistics robots. These required technologies include those that enable rapid battery charging as well wireless charging to charge batteries while moving. The development of these technologies, however, result in increasing explosions and topical accidents involving rapid charging batteries These accidents due to the thermal shock caused by the heat generated during the charging of the battery cell. In this study, a performance evaluation of a heat dissipation design using infrared thermal imaging was performed on an energy storage systrm(Ess) applied with an internal heat conduction cooling method using a heating plate.

탄소나노튜브 함량에 따른 열계면소재 방열성능 비교

김원준(Wonjoon Kim),이상훈(Sanghoon Lee),서대우(Daewoo Suh),슈첸첸(Chenchen Xu),김태훈(Taehun Kim),송창식(Changsik Song),유치종(Chijong Yoo),김영성(Youngsung Kim),김중년(Joongnyun Kim),백승현(Seunghyun Baik) 대한기계학회 2020 대한기계학회 춘추학술대회 Vol.2020 No.12

유냉식 인휠 모터의 방열특성 해석

임동현(Dong Hyun Lim),신윤혁(Yoon Hyuk Shin),김대건(Dae Geon Kim),김동현(Dong-Hyun Kim),김영광(Young-Kwang Kim),김성철(Sung Chul Kim) 한국자동차공학회 2013 한국자동차공학회 학술대회 및 전시회 Vol.2013 No.11

전후면 처리를 통한 태양광 모듈의 방열성능 향상

김철수(Chulsoo Kim),김강민(Kangmin Kim),최원석(Wonseok Choi),박영(Young Park) 한국태양에너지학회 2022 한국태양에너지학회 학술대회논문집 Vol.2022 No.4