Selective emitter 구조와 plating으로 형성된 전극을 적용한 결정질 실리콘 태양전지에 관한 연구

김민정(Kim Min-Jeong),이재두(Lee Jae-Doo),이수홍(Lee Soo-Hong) 한국태양에너지학회 2010 한국태양에너지학회 학술대회논문집 Vol.2010 No.4

The technologies of Ni/Cu plating contact is attributed to the reduced series resistance due to better contact conductivity of Ni with Si and subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading combined with the lower resistance of a metal silicide contact and improved conductivity of plated deposit. This improves the FF as the series resistance is deduced. This is very much requried in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A Selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing In this work formation of selective emitter, and the nickel silicide seed layer the front side metallization of silicon cells. After generating the nickel seed layer the contacts were thickened by Cu LIP (Light induced Plating) and formation plated Ni/Cu two step metallization on front contacts. When fabricated Ni/Cu plating metallization cell with a selective emitter structure it has been shown that the cell efficiency can be increased by at least 0.2%.

Fabrication of Parts with Integrated Circuits by Selective Electroless Plating of Additively Manufactured Plastic Substrates

Seonyeop Kim,In Hwan Lee,김호찬 한국정밀공학회 2021 International Journal of Precision Engineering and Vol.8 No.5

The use of printed circuit boards (PCBs) has become essential in manufacturing parts with electronic functions. However, the placement of PCBs inside a product requires special plates or fixtures that need to be separately designed, fabricated, and assembled. In addition, PCB manufacturing generally utilizes various toxic metals and etchants. Thus, there is a need to address the issues of space, cost, and environmental toxicity inherent in PCBs. This paper proposes a novel method of fabricating PCB-free part with electronic circuits in a set using the casing or exterior of a product. This process enables the manufacturing of a type of molded interconnect device without conventional molding technologies by directly forming conductive circuits on the side or back of 3D-printed substrates using selective electroless plating. For 3D printing of the product structure, this study uses substrates made of polylactic acid (PLA) and acrylonitrile butadiene styrene (ABS), which are commonly used in the popular material-extrusion 3D printing technology. As ABS and PLA have different chemical properties, the region to be plated with the electrical circuit is fabricated using ABS, whereas the remaining substrate is fabricated using PLA. ABS was chemically treated to allow electroless plating. A process for forming 3D circuits was developed and evaluated by selective electroless plating of the areas of the substrate requiring circuitry. To verify the applicability of the proposed process, circuits and integrated parts used in the industry were redesigned into a single component and fabricated by applying the proposed process. The results demonstrate that the proposed process has good practical applicability. Furthermore, it has low environmental toxicity with low requirements for material consumption and processing energy.

Fabrication of Hybrid Composite Plates with an Active Frequency Selective Surface

Seo, Yun-Seok,Chun, Heoung-Jae,Hong, Ic-Pyo,Park, Young-Bae,Kim, Yoon-Jae The Korean Society for Composite Materials 2017 Composites research Vol.30 No.5

This paper describes the fabrication techniques and analysis of hybrid composite plates with an active frequency selective surface (FSS). For fabricating hybrid composite plate with active FSS, an active FSS with a resonance frequency located in the C band can obtained using varactor diodes. The hybrid composite plate was first designed and simulated to determine its electromagnetic properties using the commercial software HFSS. After simulation, active FSSs and hybrid composite plates were fabricated by mounting with varactor diodes. After fabrication, free space measurement was used to determine the electromagnetic properties of active FSS and the hybrid composite plates. The simulation and experimental results were in good agreement.

Nickel Silicide for Ni/Cu Contact Mono-Silicon Solar Cells

민선규,김동호,이수홍 대한금속·재료학회 2013 ELECTRONIC MATERIALS LETTERS Vol.9 No.4

A solar cell contact needs to be as thin as possible and have high conductivity since a thick contact causes shading loss and reduced current. Plating is a very suitable method for making a metal contact, and nickel is a high conductivity metal which is easy to form into a contact using electroless plating. After the nickel is plated on the silicon substrate, the nickel contact should be fired in order to form nickel silicide. Nickel silicide is used for the seed layer of the Cu contact for silicon solar cells. In this study, we replaced the screen-printed contact of the Passivated Emitter Solar Cell (PESC) with a Ni/Cu contact that has a selective emitter. The nickel layer was used as the seed layer, adhesion layer, and Cu diffusion barrier. The main contact was formed by plating the copper. The firing conditions of a conventional furnace were varied in order to form nickel silicide. Consequently, we achieved the best solar cell efficiency of 18.15%.

축·수산·전통식품 중 황색포도상 구균의 정량적 분석을 위한 Petrifilm TM Staph Express Count Plate의 성능 평가

유윤정,최유나,최승호,방현조,윤요한,하지명,이수민 한국식품위생안전성학회 2019 한국식품위생안전성학회지 Vol.34 No.3

To enumerate Staphylococcus aureus in food, Baird-Parker Agar (BPA) is usually used in the conventional method, However it requires time and space for the preparation and plating, and incubation. Thus, use of the 3M TM Petrifilm TM Staph Express Count Plate (STX Petrifilm) might be appropriate to solve these challenging problems. The purpose of this study was to compare the efficiency of STX Petrifilm with BPA for enumeration of S. aureus in various foods. A mixture of S. aureus strains ATCC29213, ATCC25923, and ATCC13565 was inoculated on marinated pork chop, beef (chuck tender), dried filefish, semi-dried squid, rice cake, and Japchae (stir-fried glass noodles) at 2, 3, 5, and 7 Log CFU/g. S. aureus cell counts were enumerated by spread-plating on STX Petrifilm and BPA after 0 and 24 hours at 4 o C (marinated pork chop, beef, semi-dried squid, and stir-fried glass noodles) and 25 o C (dried filefish and rice cake). Recovery of STX Petrifilm for S. aureus from various food samples was compared with BPA, and the results showed that there were no significant differences between two selective media in all cases. The results indicated that STX Petrifilm had enough efficiency to recover S. aureus from various foods as well as saving time and space.

축·수산·전통식품 중 황색포도상 구균의 정량적 분석을 위한 Petrifilm^TM Staph Express Count Plate의 성능 평가

유윤정,최유나,최승호,방현조,윤요한,하지명,이수민,Yoo, Yoonjeong,Choi, Yuna,Choi, Seungho,Bang, Hyunjo,Yoon, Yohan,Ha, Jimyeong,Lee, Soomin 한국식품위생안전성학회 2019 한국식품위생안전성학회지 Vol.34 No.3

본 연구는 식품으로부터 S. aureus를 분리하는 데 사용되는 선택배지들의 성능을 평가하였다. 먼저 BPA와 MSEY agar의 민감도 비교를 통해 BPA를 선택하였고, 이 배지의 회수율을 $3M^{TM}$ $Petrifilm^{TM}$ Staph Express Count Plate(STX petrifilm)의 회수율과 비교하였다. 축산식품 중 돼지고기 주물럭과 육회용 꾸릿살, 수산식품 중 쥐포와 반건조 오징어, 전통식품 중 떡과 잡채를 선정하여 S. aureus를 접종한 후 BPA와 STX Petrifilm 배지를 사용하여 회수율 분석 실험을 실시하였다. 6가지 식품에 대해 인위적으로 S. aureus를 저농도에서부터 고농도까지 접종한 후 0시간과 24시간 후의 검출률을 측정하였다. 두 배지 간의 유의 수준을 분석한 결과 식품의 종류, 접종 농도에 관계없이 두 선택배지 간에 통계적 유의차는 없는 것으로 확인되었다(P>0.05). 따라서 STX Petrifilm은 BPA를 대체할 수 있을 뿐만 아니라 배지의 준비 및 도말에 소요되는 분석시간을 절감하고 배양에도 최소한의 공간이 필요하게 되어 신속, 정확한 분석에 크게 기여할 수 있을 것으로 판단된다. To enumerate Staphylococcus aureus in food, Baird-Parker Agar (BPA) is usually used in the conventional method, However it requires time and space for the preparation and plating, and incubation. Thus, use of the $3M^{TM}$ $Petrifilm^{TM}$ Staph Express Count Plate (STX Petrifilm) might be appropriate to solve these challenging problems. The purpose of this study was to compare the efficiency of STX Petrifilm with BPA for enumeration of S. aureus in various foods. A mixture of S. aureus strains ATCC29213, ATCC25923, and ATCC13565 was inoculated on marinated pork chop, beef (chuck tender), dried filefish, semi-dried squid, rice cake, and Japchae (stir-fried glass noodles) at 2, 3, 5, and 7 Log CFU/g. S. aureus cell counts were enumerated by spread-plating on STX Petrifilm and BPA after 0 and 24 hours at $4^{\circ}C$ (marinated pork chop, beef, semi-dried squid, and stir-fried glass noodles) and $25^{\circ}C$ (dried filefish and rice cake). Recovery of STX Petrifilm for S. aureus from various food samples was compared with BPA, and the results showed that there were no significant differences between two selective media in all cases. The results indicated that STX Petrifilm had enough efficiency to recover S. aureus from various foods as well as saving time and space.

황동층의 형성과 선택적 아연 에칭을 통한 구리 필라 상 다공성 구리층의 제조와 구리-구리 플립칩 접합

이완근,최광성,엄용성,이종현 한국마이크로전자및패키징학회 2023 마이크로전자 및 패키징학회지 Vol.30 No.4

대기 중 구리-구리 플립칩(flip-chip) 접합을 위해 제안된 효율적 공정의 실현 가능성을 평가하고자 구리(Cu) 필라(pillar) 상 다공성 구리층의 형성 및 액상 환원제 투입 후 열압착 접합을 실시하였다. 구리 필라 상 다공성 구리층은 아연(Zn) 도금-합금화 열처리-선택적 아연 에칭(etching)의 3단계 공정으로 제조되었는데, 형성된 다공성 구리층의 두께는 평균 약 2.3 ㎛였다. 본 플립칩 접합은 형성 다공성 구리층에 환원성 용제를 침투시킨 후, 반건조 과정을 거쳐 열압착 소결접합으로 진행하였다. 용제로 인한 구리 산화막의 환원 거동과 함께 추가 산화가 최대한 억제되면서 열압착 동안 다공성구리층은 약 1.1 ㎛의 두께로 치밀해지며 결국 구리-구리 플립칩 접합이 완수되었다. 그 결과 10 MPa의 가압력 하에서 대기 중 300 ℃에서 5분간 접합 시 약 11.2 MPa의 접합부 전단강도를 확보할 수 있었는데, 이는 약 50% 이하의 필라들만이접합된 결과로서, 공정 최적화를 통해 모든 필라들의 접합을 유도할 경우 20 MPa 이상의 강도값을 쉽게 얻을 수 있을 것으로 분석되었다. The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 μm. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 μm during the thermo-compression, and the Cu- Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.

탈질설비 내 믹스플레이트 형상에 따른 암모니아 분포 균일도 연구

허재원(Jaewon Heo) 대한기계학회 2021 대한기계학회 춘추학술대회 Vol.2021 No.11

In order to improve the performance of the SCR facility, it is important to uniform the distribution of ammonia concentration at the front end of the catalyst layer. The purpose of this study is to suggest the optimal shape of the mix plate by analyzing the distribution characteristics of ammonia in the SCR facility according to the shape of the mix plate. The basis for the judgment is the ammonia concentration %RMS value at the front end of the catalyst layer. As a result of computational fluid dynamics analysis, the ammonia concentration at the front end of the catalyst layer is the most uniform when the shape of the mix plate is the largest.

Microtiter Plate형 전이금속 Optode 개발 연구

임채윤 ( Chae Yun Lim ),팽기정 ( Ki Jung Paeng ),김현숙 ( Hyun Sook Kim ),이인숙 ( In Sook Rhee ) 한국환경분석학회 2003 환경분석과 독성보건 Vol.6 No.4

Selective Emitter 구조를 적용한 Ni/Cu Plating 전극 결정질 실리콘 태양전지

김민정,이재두,이수홍,Kim, Min-Jeong,Lee, Jae-Doo,Lee, Soo-Hong 한국전기전자재료학회 2010 전기전자재료학회논문지 Vol.23 No.7

The technologies of Ni/Cu plating contact is attributed to the reduced series resistance caused by a better contact conductivity of Ni with Si and the subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading was combined with the lower resistance of a metal silicide contact and an improved conductivity of the plated deposit. This improves the FF (fill factor) as the series resistance is reduced. This is very much requried in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A Selective emitter structure with highly dopeds regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing In this paper the formation of a selective emitter, and the nickel silicide seed layer at the front side metallization of silicon cells is considered. After generating the nickel seed layer the contacts were thickened by Cu LIP (light induced plating) and by the formation of a plated Ni/Cu two step metallization on front contacts. In fabricating a Ni/Cu plating metallization cell with a selective emitter structure it has been shown that the cell efficiency can be increased by at least 0.2%.