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- 주제어 : Refolw soldering (검색결과 2 건)
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Pb Free 솔더를 사용한 솔더 접합부의 접합 강도 향상에 관한 연구
신영의,김영탁 대한용접접합학회 1997 대한용접·접합학회지 Vol.15 No.2
In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.
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리플로우 시간에 따른 Sn-4Ag 솔더접합부 FEM 전단해석
유효선(Hyosun Yu),양성모(Sungmo Yang),손인덕(Indeok Son),최승준(Seungjun Choi) 한국자동차공학회 2015 한국자동차공학회 부문종합 학술대회 Vol.2015 No.5
The evaluation on reliability of environment-friendly Pb-free solder and solder joints is very important. The correlation between interface reaction and mechanical properties of solder joints was confirmed in this study. And shear test are performed using SP(Share-Punch) tester. The shear strength tests on various reflow time are performed at 10,30,00 and 300sec. Tested specimens were examined in order to observe the failure mode on solder joints. The test result about solder joints of two different plate(Ni and Cu plate) are compared. Ni plate joints shown low IMC growth rate. The shear strength of Pb-free solder joints are higher than Sn-37 Pb solder joints, generally. In the case of Cu plate, shear strength of Sn-4Ag solder joints increased with reflow time. And solder joints with Cu contents are seems to similar in strength regardless of reflow time. on the other hand, in the case of Ni plate joints, shear strength of Sn-37Pb solder joints are similar to Sn-4Ag solder joints. Like Cu plate joints, solder joints with Cu contents are seems to similar in strength regardless of reflow time.
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