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이재종(JaeJong Lee),최기봉(KeeBong Choi),김기홍(GeeHong Kim),이승우(SeungWoo Lee),조현택(HyunTaek Cho) 한국생산제조학회 2006 한국생산제조시스템학회 학술발표대회 논문집 Vol.2006 No.5
Nanoimprint lithography is a promising technology to produce sub-50㎚ half-pitch features on silicon chips. The contact-based nano lithography, such as thermal and/or UV nano-imprint, is well-known as the next generation lithography. Especially, the UV nano-imprint lithography technology has advantages of the simple process, low cost, high replication fidelity, and relatively high throughput(1). To achieve nano-imprinting process, nano-imprinting lithography equipment must have required some multi-functional units which are imprinting head, self-alignment wafer stage, overlay and alignment system for multi-layer process, master with sub-50㎚ half-pitch patterns, and anti-vibration unit, etc.
이재종(JaeJong Lee),최기봉(KeeBong Choi),김기홍(GeeHong Kim),이승우(SeungWoo Lee),조현택(HyunTaek Cho) 한국생산제조학회 2006 한국공작기계학회 춘계학술대회논문집 Vol.2006 No.-
Nanoimprint lithography is a promising technology to produce sub-50㎚ half-pitch features on silicon chips. The contact-based nano lithography, such as thermal and/or UV nano-imprint, is well-known as the next generation lithography. Especially, the UV nano-imprint lithography technology has advantages of the simple process, low cost, high replication fidelity, and relatively high throughput(1). To achieve nano-imprinting process, nano-imprinting lithography equipment must have required some multi-functional units which are imprinting head, self-alignment wafer stage, overlay and alignment system for multi-layer process, master with sub-50㎚ half-pitch patterns, and anti-vibration unit, etc.
PECVD를 이용한 금속 스탬프용 점착방지막 형성과 특성 평가
차남구,박창화,조민수,김규채,박진구,정준호,이응숙,Cha, Nam-Goo,Park, Chang-Hwa,Cho, Min-Soo,Kim, Kyu-Chae,Park, Jin-Goo,Jeong, Jun-Ho,Lee, Eung-Sug 한국재료학회 2006 한국재료학회지 Vol.16 No.4
Nanoimprint lithography (NIL) is a novel method of fabricating nanometer scale patterns. It is a simple process with low cost, high throughput and resolution. NIL creates patterns by mechanical deformation of an imprint resist and physical contact process. The imprint resist is typically a monomer or polymer formulation that is cured by heat or UV light during the imprinting process. Stiction between the resist and the stamp is resulted from this physical contact process. Stiction issue is more important in the stamps including narrow pattern size and wide area. Therefore, the antistiction layer coating is very effective to prevent this problem and ensure successful NIL. In this paper, an antistiction layer was deposited and characterized by PECVD (plasma enhanced chemical vapor deposition) method for metal stamps. Deposition rates of an antistiction layer on Si and Ni substrates were in proportion to deposited time and 3.4 nm/min and 2.5 nm/min, respectively. A 50 nm thick antistiction layer showed 90% relative transmittance at 365 nm wavelength. Contact angle result showed good hydrophobicity over 105 degree. $CF_2$ and $CF_3$ peaks were founded in ATR-FTIR analysis. The thicknesses and the contact angle of a 50 nm thick antistiction film were slightly changed during chemical resistance test using acetone and sulfuric acid. To evaluate the deposited antistiction layer, a 50 nm thick film was coated on a stainless steel stamp made by wet etching process. A PMMA substrate was successfully imprinting without pattern degradations by the stainless steel stamp with an antistiction layer. The test result shows that antistiction layer coating is very effective for NIL.
Lithography potentials of UV-nanoimprint
A. Fuchs,M. Bender,U. Plachetka,L. Kock,N. Koo,T. Wahlbrink,H. Kurz 한국물리학회 2008 Current Applied Physics Vol.8 No.6
In the past decade nanoimprint has been developed to a serious alternative for next generation lithography (NGL). In this work, the most recent developments of UV-nanoimprint Lithography (UV-NIL) with special emphasis to the work accomplished at AMO and the IHT-RWTH Aachen are reviewed and functional applications demonstrated. Further the potentials of various UV-NIL concepts are evaluated and possible interests in certain application areas are discussed. In the past decade nanoimprint has been developed to a serious alternative for next generation lithography (NGL). In this work, the most recent developments of UV-nanoimprint Lithography (UV-NIL) with special emphasis to the work accomplished at AMO and the IHT-RWTH Aachen are reviewed and functional applications demonstrated. Further the potentials of various UV-NIL concepts are evaluated and possible interests in certain application areas are discussed.
Deformation Analysis of Roll Mold for Nano-flexible Devices
Amin Khaliq(Amin Khaliq ),Usama Tahir(Usama Tahir ),Jeong Myung Yung (Jeong Jeong) 한국마이크로전자및패키징학회 2021 마이크로전자 및 패키징학회지 Vol.28 No.4
Nanoimprint lithography (NIL) has revolutionized the fabrications of electronics, photonics, optical and biological devices. Among all the NIL processes, roll-to-roll nanoimprinting is regarded best for having the attributes of low cost, continuous, simple, and energy-efficient process for nanoscale device fabrication. However, large-area printing is limited by the master mold deformation. In this study, a finite element model (FEM) has been constructed to assess the deformation of the roll mold adhesively wrapped on the carbon fiber reinforced material (CFRP) base roll. This study also optimizes the deformations in the metallic roll mold with respect to nip-forces applied in the printing process of nano-fabrication on large scale. The numerical simulations were also conducted to evaluate the deflection in roll mold assembly due to gravity. The results have shown decreasing trend of the deformation with decreasing nip-force. Also, pressure uniformity of about 40% has been optimized by using the current numerical model along with an acceptable deflection value in the vertical axis due to gravity.
〈학술논문〉 나노 임프린트 공정(NIL)에 사용되는 몰드와 기판사이의 이형성 평가
박재홍(Jae-Hong Park),김태우(Tae Woo Kim),이기성(Kee Sung Lee) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.11
Nanoimprint lithography is a technique which is expected to obtain micro or nanometer scaled patterns into the substrate by transferring the pre-determined patterns of mold using electron beam, UV, or pressure. In this process, UV resin is deformed by patterned-mold, and cured by UV(Ultraviolet rays). The adhesion behavior has influence on the alignment of micro, nano patterns during nanoimprint process. The adhesion behavior is closely related with productivity. In this study we measure adhesion force and interfacial energy between mold and resin by 4 point bending test and pullout test. The results of different behaviors along with changes of mold materials and lubricants were compared to each other.
류진화(J. H. Ryu),김창석(C. S. Kim),정명영(M. Y. Jeong) 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
The fabrication of mold for nano imprint lithography (NIL) is experimentally reported using the scanning probe lithography (SPL) technique, instead of the conventional E-beam lithography technique. The nanometer scale patterning structure is fabricated by the localized generation of oxide patterning on the silicon (100) wafer surface with a thin oxide layer. The fabrication method is based on the contact mode of scanning probe microscope (SPM) in air. The precision cleaning process is also performed to reach the low roughness value of R<SUB>rms</SUB> = 0.084 ㎚, which is important to increase the reproducibility of patterning. The height and width of the oxide dot are generated to be 15.667 ㎚ and 209.5 ㎚, respectively, by applying 17 V during 350 ㎳.
이재종(JaeJong Lee),박수연(SooYeon Park),김신호(ShinHo Kim) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
The contact-based nanoimprinting lithography (NIL), such as thermal and/or UV nano-imprint, has been well known as one of the next generation lithography alternatives. Especially, the thermal nano-imprinting lithography technology has the advantages in terms of process simplicity, low cost, high replication fidelity, and relatively high throughput. In case of nanoimprinting process, a master stamp fabrication and its lifetime are key issues in order to fabricate nanoscale patterns on the Si and quartz substrate. The lifetime of the master stamp is caused by using various materials and imprinting pressure to make replica with nanoscale patterns. Generally, the master stamp fabrication cost is proportional increased to fabrication frequency of the nano-patterned master stamp. In this paper, the replication process for the replicas which has the high fidelity and high quality are proposed to get over the short lifetime and high cost problems to fabricate nanoscale stamp. In order to do, thermal imprinting lithography tool which is developed by KIMM was used to do 4inch Si and quartz stamp replication.
이재종(JaeJong Lee),박수연(SooYeon Park),김신호(ShinHo Kim) 한국생산제조학회 2007 한국생산제조시스템학회 학술발표대회 논문집 Vol.2007 No.5
The contact-based nanoimprinting lithography (NIL), such as thermal and/or UV nano-imprint, has been well known as one of the next generation lithography alternatives. Especially, the thermal nano-imprinting lithography technology has the advantages in terms of process simplicity, low cost, high replication fidelity, and relatively high throughput. In case of nanoimprinting process, a master stamp fabrication and its lifetime are key issues in order to fabricate nanoscale patterns on the Si and quartz substrate. The lifetime of the master stamp is caused by using various materials and imprinting pressure to make replica with nanoscale patterns. Generally, the master stamp fabrication cost is proportional increased to fabrication frequency of the nano-patterned master stamp. In this paper, the replication process for the replicas which has the high fidelity and high quality are proposed to get over the short lifetime and high cost problems to fabricate nanoscale stamp. In order to do, thermal imprinting lithography tool which is developed by KIMM was used to do 4inch Si and quartz stamp replication.
레지스트 잔류층 두께와 몰드 유입속도가 기포결함에 미치는 영향에 대한 수치해석
이우영,김남웅,김동현,김국원 한국반도체디스플레이기술학회 2015 반도체디스플레이기술학회지 Vol.14 No.3
Recently, the major trends of NIL are high throughput and large area patterning. For UV NIL, if it can be proceeded in the non-vacuum environment, which greatly simplifies tool construction and greatly shorten process times. However, one key issue in non-vacuum environment is air bubble formation problem. In this paper, numerical analysis of bubble defect of UV NIL is performed. Fluent, flow analysis focused program was utilized and VOF(Volume of Fluid) skill was applied. For various resist-substrate and resist-mold angles, effects of velocity inlet and residual layer thickness of resist on bubble defect formation were investigated. The numerical analyses show that the increases of velocity inlet and residual layer thickness can cause the bubble defect formation, however the decreases of velocity inlet and residual layer thickness take no difference in the bubble defect formation.