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백병만(Byoungman Paik),이제훈(Jaehoon Lee),신동식(Dongsig Shin),이건상(Kunsang Lee) 한국생산제조학회 2012 한국생산제조학회지 Vol.21 No.1
The purpose of this study is on the development of 3-D conductive pattern fabrication system using laser. For development 3-D direct patterning system, we used the dynamic focusing, the laser power stabilizer and the auto aligning techniques. These technologies are already used commercially. However operation and control integrated system for 3-D direct patterning are not yet developed. The objective of this paper is to introduce laser direct structuring and develop the operating and integration system. Also we implemented new application of laser direct structuring.
Fabrication of micro-conductive patterns on glass surfaces using a laser direct writing method
이봉구 한양대학교 세라믹연구소 2009 Journal of Ceramic Processing Research Vol.10 No.6
A micro-conductive pattern was fabricated on an insulating substrate (SiO2) surface using a direct laser writing method known as laser-induced forward transfer (LIFT). The LIFT process, employing a multi-scan mode laser, fabricated the microconductive pattern using an electroless nickel plating procedure as a method for improving the deposition process of the seed pattern on the insulating substrate surface and the electrical conductivity of the pattern. In the multi-scan mode LIFT process, when the laser beam irradiates a thin metal film, the photon energy is absorbed by the film and converted into thermal energy, and the thermal decomposition reaction produced by the resulting heat conduction forms a deposit on the substrate. This paper analyzes the impact of seed pattern formation by LIFT, and the impact of key variables in the electroless nickel plating process, on the micro-conductive pattern fabrication, using scanning electron microscopy (SEM) and an optical microscope. It also examines the impact of the process variables on the cross-sectional shape and surface quality of the deposited pattern.
김광열,Kim, Kwang-Ryul 한국재료학회 2007 한국재료학회지 Vol.17 No.7
Since a pattern defects "repair" system using a diode pumped solid state laser for Flat Panel Display (FPD) was suggested, a lot of laser systems have been explored and developed for mass-production microfabrication process. A maskless lithography system using 405 nm violet laser and Digital Micromirror Device (DMD) has been developed for PDP and Liquid Crystal Display (LCD) Thin Film Transistor (TFT) photolithography process. In addition, a "Laser Direct Patterning" system for Indium Tin Oxide (ITO) for Plasma Display Panel(PDP) has been evaluated one of the best successful examples for laser application system which is applied for mass-production lines. The "heat" and "solvent" free laser microfabrications process will be widely used because the next-generation flat panel displays, Flexible Display and Organic Light Emitting Diode (OLED) should use plastic substrates and organic materials which are very difficult to process using traditional fabrication methods.
레이저 직접묘화법을 이용한 미세패턴 전도성 향상에 관한 연구
이봉구(Bong-Gu Lee) 한국산학기술학회 2017 한국산학기술학회논문지 Vol.18 No.5
본 논문에서는 레이저 유도증착 공정을 사용하여 절연기판위에 미세패턴의 전도성 향상시켰다. 기존의 레이저 유도증착의 공정에서 발생하는 높은 레이저빔 에너지로 인하여, 미세패턴의 낮은 증착밀도, 산화와 같은 문제점이 있다. 이러한 문제점을 폴리머 코팅층을 사용하여 증착정밀도와 전도성 향상하였다. 실리콘 웨이퍼 위에 미세패턴 증착을 위해서 크롬, 구리를 사용하였다. 본 연구에서는 다중펄스 방식의 레이저 빔을 금속박막에 조사하여 절연기판(insulating substrate: SiO₂) 위에 시드 층을 형성하고, 형성된 시드 층위에 무전해 도금을 적용하여 미세패턴 및 구조물을 제작하는 복합공정기술을 개발하였다. 레이저빔의 다중 스캔방식으로 조사함으로서 레이저빔의 에너지가 증착 층의 증착밀도와 표면품위를 향상시키고, 미세전극 패턴으로 사용가능한 전기 전도성을 갖게 되었음 알 수 있었다. 레이저 직접묘화법과 무전해 도금을 적용한 복합공정을 이용하여 미세전극을 증착 한 후 비저항을 측정한 결과 도금 전 저항이 6.4Ω, 도금 후의 저항이 2.6Ω으로 미세전극패턴의 표면조직이 균일하고 증착되었다. 표면조직이 균일하고 치밀하게 증착되었기 때문에 전기 전도도가 약 3배정도 향상되었다. In this paper, the conductivity of the fine pattern is improved in the insulating substrate by laser-induced forward transfer (LIFT) process. The high laser beam energy generated in conventional laser induced deposition processes induces problems such as low deposition density and oxidation of micro-patterns. These problems were improved by using a polymer coating layer for improved deposition accuracy and conductivity. Chromium and copper were used to deposit micro-patterns on silicon wafers. A multi-pulse laser beam was irradiated on a metal thin film to form a seed layer on an insulating substrate(SiO2) and electroless plating was applied on the seed layer to form a micro-pattern and structure. Irradiating the laser beam with multiple scanning method revealed that the energy of the laser beam improved the deposition density and the surface quality of the deposition layer and that the electric conductivity can be used as the microelectrode pattern. Measuring the resistivity after depositing the microelectrode by using the laser direct drawing method and electroless plating indicated that the resistivity of the microelectrode pattern was 6.4Ω, the resistance after plating was 2.6Ω, and the surface texture of the microelectrode pattern was uniformly deposited. Because the surface texture was uniform and densely deposited, the electrical conductivity was improved about three fold.
무전해 니켈 도금을 이용한 절연기판상의 미세전도성 패턴 제조
이봉구 ( Bong Gu Lee ),문준희 ( Jun Hee Moon ) 대한금속·재료학회 2010 대한금속·재료학회지 Vol.48 No.1
Micro-conductive patterns were microfabricated on an insulating substrate (SiO2) surface by a selective electroless nickel plating process in order to investigate the formation of seed layers. To fabricate micro-conductive patterns, a thin layer of metal (Cu.Cr) was deposited in the desired micropattern using laser-induced forward transfer (LIFT). and above this layer, a second layer was plated by selective electroless plating. The LIFT process. which was carried out in multi-scan mode, was used to fabricate micro-conductive patterns via electroless nickel plating. This method helps to improve the deposition process for forming seed patterns on the insulating substrate surface and the electrical conductivity of the resulting patterns. This study analyzes the effect of seed pattern formation by LIFT and key parameters in electroless nickel plating during micro-conductive pattern fabrication. The effects of the process variables on the cross-sectional shape and surface quality of the deposited patterns are examined using field emission scanning electron microscopy (FE-SEM) and an optical microscope.
백병만(Byoung Man Paik),이제훈(Jae Hoon Lee),신동식(Dong Sig Shin),이건상(Kun Sang Lee) 대한기계학회 2011 대한기계학회 춘추학술대회 Vol.2011 No.5
The purpose of this study is to Development of 3-D Conductive Pattern Fabrication using Laser. Direct patterning of 3-D for the implementation of technology systems are dynamic focusing, laser power stabilizer and auto align. These technologies are already used commercially. But, operation and control integrated system for 3-d direct patterning are not yet developed in Korea. In this paper, developed the operating and integration system was introduced for 3-D conductive pattern formation.
Ag Electrode Strain Sensor Fabrication Using Laser Direct Writing Process
( Hyeon Seok Kim ),( Jae Ho Shin ),( Suk Joon Hong ),( Seung Hwan Ko ) 한국센서학회 2015 센서학회지 Vol.24 No.4
As several innovative technologies for flexible electric devices are being realized, demand for in-situ strain monitoring for flexible electric devices is being emphasized. Because flexible devices are commonly influenced by substrate strain, suitable strain sensors for flexible devices are essential for the sophisticated maneuvering of flexible devices. In this study, a flexible strain sensor based on an Ag electrode is prepared on a polyimide substrate using the LDW (laser direct writing) process. In this process, first, the Ag nanoparticles are coated on the substrate and selectively sintered using a focused laser. Because of the advantages of the LDW process (such as being mask-less, using low temperatures, and having non-vacuum characteristics), the entire fabrication process has been dramatically simplified; as a final outcome, a highly reliable strain sensor has been fabricated. Using this strain sensor, various strain conditions that arise from different bending radii can be detected by measuring real-time electrical signals.
이층 박막 구조에서 ITO 전극의 레이저 직접 패터닝 시레이저 식각 패턴 중첩 비율의 변화
왕건훈,박정철,권상직,조의식,Wang, Jian-Xun,Park, Jung-Cheul,Kwon, Sang-Jik,Cho, Eou-Sik 한국전기전자재료학회 2012 전기전자재료학회논문지 Vol.25 No.5
Laser direct patterning of indium tin oxide(ITO) is one of new methods of direct etching process to replace the conventional photolithography. A diode pumped Q-switched Nd:$YVO_4$ (${\lambda}$= 1,064 nm) laser was used to produce ITO electrode on various transparent oxide semiconductor films such as zinc oxide(ZnO). The laser direct etched ITO patterns on ZnO were compared with those on glass substrate and were considered in terms of the overlapping rate of laser beam. In case of the laser etching on double-layer, it was possible to obtain the higher overlapping rate of laser beam.